EVG®770 Automated NIL Stepper
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先进封装,三维层叠互联

Wafer level packaging employs specific alignment and wafer bonding techniques as an enabling solution for stacking of wafers and three-dimensional integration of devices.

   

纳米技术

Nanoimprint Lithography (NIL) is one of the most promising and cost-effective new techniques for generating nanometer-scale-resolution patterns for a variety of commercial applications in BioMEMS, microfluidics, optics, patterned media and electronics.