For automatic single and double-side µ-CP processes.
EVG Next-Gen NIL Technology Targets Photonics, LED and Bioengineered Device Production
EVG Unveils Room-Temp Covalent Bonder for Engineered Substrate and Power Device Production
New Wafer-Level Microlens Molding Process from EV Group
Himax Technologies Selects EVG to Expand Production Capacity for WLO
EV Group Corporate Video
3D InCites reports on EVG Headquarters expansion and technology developments
Consortium for Commercialization of Nano Imprint Lithography (NIL)