EVG®520HE Semi-Automated Hot Embossing System

For hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

 

  • Stamper/substrate size: up to 200 mm diagonal
  • Stack thickness:  max. 15 mm
  • Contact force:  10 kN, 20 kN, 60 kN, 100 kN 
  • Temperature up to 550°C
  • Temperature stability: ± 1 %
  • Temperature uniformity: ± 1.5 %
  • Vacuum capability: down to 10-5 mbar