For hot embossing applications of polymer substrates and spin-on polymers
with excellent pattern fidelity.
Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding
EVG and NNFC announced results on improved transparent nanostructured anti-reflective coatings for next-gen displays
SEMI European 3D Summit 2017
SEMICON Korea 2017
EV Group Corporate Video