Known for its high level of automation and reliability, the EVG620 is a
dual-use tool designed for optical double-side lithography and precision
alignment up to 150 mm wafer sizes. Volume production types and manual
R&D systems are available. An ultra-soft wedge compensation
together with a computer controlled contact force between the mask and
wafer ensures that both yield and mask lifetime are dramatically increased
while production costs are lowered. The fully-automated EVG620 utilizes a
cassette-to-cassette handling system to efficiently process wafers from 50
mm to 150 mm in diameter, regardless of their shape or thickness. The
system safely handles thick, bowed or small diameter wafers. The EVG620
superior alignment stage design achieves highly accurate alignment and
exposure results while maintaining high throughput.
Features
- High resolution top and bottom side splitfield microscopes
- Handling of multiple wafer sizes with quick change-over time
- High degree of automation (multiple send/receive cassettes)
- Manual substrate loading capability on automated system
- Windows® based
user interface
- Options
- Cassette-to-cassette handling system
- Automatic alignment
- Field upgradeable from manual to fully-automated version
-
NanoAlign® package for
enhanced process capabilities
- Thin or warped wafer handling
- Nanoimprint lithography and micro contact printing
- Bond alignment
- Simulation software for mask aligner lithography process