EVG®40NT Automated Measurement System

For alignment accuracy measurements

Substrate parameters:
Substrate size: 300 mm
Substrate thickness: 20 mm
Alignment stage:
Chuck alignment stage: recovers the whole area of a 300 mm wafer
Measurement accuracy:
99% of measurements will be no more than +/-100 nm from the true value
Specification for 20x objectives and good contrast alignment keys
Automatic measurement: Image recognition system (optional)
Handling system: Three-axis robot, send, receive and reject cassettes, up to 300 mm wafers
Robot accuracy: ± 50 µm, ±0.1°
Accuracy of prealignment station: X: ± 50 µm, Y: ± 50 µm, Theta: ± 0.09°
Microscope:
Objectives: 5x (Option 10x, 20x)
Camera: High resolution BW-CCD camera; displayed in software window

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