Designed as a fully modular platform, the EVG150 allows automated spray/spin/develop processess and high-thoroughput performance. The EVG150 produces highly uniform coats and improves repeatability to suit these needs. Wafers with high topography can be uniformly coated by EVG’s OmniSpray® technology, where traditional spin coating encounters limitations.
Features
- OmniSpray® (x/y or rotational spray coating)
- Spinner modules for coating (spin) or developing
- Bake modules
- Chill modules
- Cost effective system for optimized production
- Sophisticated field-proven wafer handling by robot
- System customized for best benefit, including tooling (chucks), handling
(robot endeffector, pre-aligner) and modules
- Options
- OmniSpray
® coating for optimized coating of high topography surfaces
- Temperature controlled resist & developer lines
- Bake modules for up to 350 °C
- Vapor prime
- Handling of thick, bowed or small diameter wafers
- Handling of ultrathin and fragile substrates
- SMIF Input output modules (for 150 + 200 mm)
- FOUP load ports (for 200 + 300 mm)