The EVG100 series resist processing systems establish new standards in
quality and flexibility for photo resist coating and developing.
Designed to provide the widest range of process variations, the EVG100
series' modularity accepts spin and spray coating, developing, bake and
chill modules to suit your individual production requirements. These
systems accommodate the processing of an extensive range of materials such
as positive and negative resists, polyimides, double-sided coating of thin
resist layers, high viscosity resists, and edge protection coatings.
EVG resist processing systems provide a high degree of versatility. They
can process wafers from 2" to 300mm diameter, rectangle, square or even
irregular shaped substrates. Also, these systems can handle more than one
substrate size, up to 200mm, with no or a very short tooling time.
Additional features such as wafer edge handling or thin wafer handling are
regularly provided for customers. EVG also offers systems for larger
substrate sizes, e.g. for the field of display manufacturing. These
functions provide for a wide range of applications in MEMS/MOEMS and
semiconductor markets. As with all EVG processing systems, the equipment
can be configured for high volume production or R&D environments.