Configurable for all wafer bonding processes such as eutectic, thermo compression, fusion bonding, or LowTemp plasma bonding.
JOANNEUM RESEARCH and EV Group Jointly Develop Large-Area Nanoimprint Lithography Solution
EV Group Introduces Industry's First Fully Automated Wafer Bonding System for HB-LED Manufacturing
EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology
EV Group Corporate Video