Configurable for all wafer bonding processes such as eutectic, thermo compression, fusion bonding, or LowTemp plasma bonding.
EV Group NILPhotonics™ Competence Center Sees Strong Customer Demand
SEMICON Russia 2015
EV Group Introduces Industry's First Fully Automated Wafer Bonding System for HB-LED Manufacturing
EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology
EV Group Corporate Video
3D InCites reports on EVG Headquarters expansion and technology developments