The EVG540C2W is an automated chip-to-wafer bonding system designed for pilot line and manufacturing as well as R&D for high volume manufacturing. Based on modular design the EVG540C2W provides a proven solution for later transition of wafer bonding processes from R&D stage to large-scale manufacturing on our fully integrated production bonding systems.
- Fully-automated processing with automated loading and unloading of bond chucks
- Single chamber production bonder
- Dedicated for chip-to-wafer and wafer-to-wafer bond processes
- Pressure cover with programmable center point of gravity