Configurable for all wafer bonding processes such as anodic, thermo
compression, fusion bonding, or LowTemp plasma bonding.
EV Group Joins IRT Nanoelec 3D Integration Program
Korean National Nanofab Center Installs High-Vacuum Wafer Bonder from EV Group for Advanced MEMS Research and Foundry Services
CS International 2016
EV Group Wins Order for UV-NIL/Hot Embossing Systems from Fraunhofer ENAS
EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology
EV Group Corporate Video