Configurable for all wafer bonding processes such as anodic, thermo
compression, fusion bonding, or LowTemp plasma bonding.
EV Group Rolls Out Automated Metrology System for Advanced Packaging, MEMS and Photonics Manufacturing
EV Group Expands High-Vacuum Wafer Bonding Capabilities of EVG ComBond Platform for High-Volume MEMS Manufacturing
EV Group Wins Order for UV-NIL/Hot Embossing Systems from Fraunhofer ENAS
EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology
EV Group Corporate Video