Configurable for all wafer bonding processes such as anodic, thermo
compression, fusion bonding, or LowTemp plasma bonding.
JOANNEUM RESEARCH and EV Group Jointly Develop Large-Area Nanoimprint Lithography Solution
EV Group Wins Order for UV-NIL/Hot Embossing Systems from Fraunhofer ENAS
EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology
EV Group Corporate Video