Configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp™ plasma bonding.
EV Group Rolls Out Automated Metrology System for Advanced Packaging, MEMS and Photonics Manufacturing
EV Group Expands High-Vacuum Wafer Bonding Capabilities of EVG ComBond Platform for High-Volume MEMS Manufacturing
SEMICON Taiwan 2016
Nemotek Technologie selects EV Group's Solutions for Capacity Ramp
EV Group Strengthens Presence in Middle East
EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology
EV Group Corporate Video