EVG®520IS Semi-automated Wafer Bonding System

Configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp™ plasma bonding.

 

The EVG520IS Semi-automated Wafer Bonding System handles wafers up to 200 mm with semi-automated operation for small volume production applications. Redesigned based on customer feedback and EV Group's continuous technological innovations, the EVG520IS features EV Group's proprietary symmetric rapid heating and cooling chuck design. Advantages such as independent top and bottom side heater, high pressure bonding capability and same material and process flexibility as on manual systems contribute to the success of all wafer bonding processes.

Features

  • Fully-automated processing with manual loading and unloading including external cooling station
  • Single or double chamber automated system
  • Fully automated bond process execution and bond cover movements
  • Multi-stack bonding options
  • Integrated cooling station for high throughput
  • Options:
    - Turbo molecular pump
    - High vacuum capability
    - Programmable mass flow controller