EVG®850TB Automated Temporary Bonding System

For temporary bonding of a substrate on a rigid carrier.

 

The temporary bonding process includes the application of the intermediate material on the carrier wafer before assembly is done in a bond chamber.

The different types of intermediate materials, e.g. thermo-plast adhesives, waxes, resists or tapes require different technologies to apply them on a substrate.

For liquid materials like adhesives, waxes and resists, a spin coating process is used. The process usually includes spin coating followed by a bake step before the bonding takes place. As for dry film tapes, the tape will be laminated onto the substrate in a lamination station before the final bonding step with the device wafer takes place.

Carrier preparation and temporary bonding according to the ZoneBONDTM process can be performed on the system as well.


Features

  • Drag and drop recipe creation
  • Void-free bonding in a controlled atmosphere
  • Device wafers are precisely centered with respect to the carrier wafers regardless of diameter differences
  • Various carriers (silicon, glass, sapphire, etc…)
  • Bridge tool capability
  • Modular integration of standardized modules
  • Extendable layout
  • Options
    - Inline metrology module