For SOI, MEMS, compound semiconductors and advanced substrate bonding.
Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding
EVG and NNFC announced results on improved transparent nanostructured anti-reflective coatings for next-gen displays
CS International 2017
IMAPS Device Packaging 2017
SOI & Engineered Substrates
EV Group Advances SOI Leadership and Presence in China with First Order from SST
EV Group Corporate Video