EVG®320 Automated Single Wafer Cleaning System

Designed for efficient removal of particles.

 

The EVG320 Automated Single Wafer Cleaning System handles wafers and substrates automatically between the process stations. The robot handling system ensures pre-alignment and loading of the wafers automatically in a cassette-to-cassette or FOUP-to-FOUP operation. Besides Di-water rinse, configuration options include megasonic, brush and diluted chemicals cleaning.

Features

  • Up to four cleaning stations
  • Fully-automated cassette-to-cassette or FOUP-to-FOUP handling
  • Edge handling for double-sided cleaning processes available (option)
  • High efficiency cleaning using 1 MHz megasonic nozzles or area transducers (option)
  • Advanced remote diagnostics
  • Prevents cross-contamination from back to front side
  • Fully software controlled cleaning process