The SmartView®NT Automated Bond Alignment System for Universal Alignment offers a proprietary method for micron level face-to-face wafer level alignment. This alignment technique is key to achieving the required accuracy in multiple wafer stacking for leading edge technologies. SmartView technology can be combined with the GEMINI wafer bonding systems for subsequent permanent bonding in a fully automated platform.
- Wafer stacking for 3D interconnect, wafer level packaging and high volume MEMS devices
- Universal bond alignment (face-to-face-, backside-, infrared- and transparent alignment)
- No Z-axis motion and no refocusing required
- Windows® based user interface
- Bond pairs are aligned and clamped prior to loading into the bond chamber
- Manual or fully automated configurations (e.g. integration with GEMINI)
- Can be combined with the EVG500 series wafer bonding systems, EVG300 series cleaning systems and EVG810LT plasma systems for a fully automated wafer-to-wafer alignment operation with cassette-to-cassette operation