EVG®620 Automated Bond Alignment System

For wafer-to-wafer alignment for subsequent wafer bonding applications.

 

Known for its high level of automation and reliability, the EVG620 Automated Bond Alignment System is designed for wafer-to-wafer alignment up to 150 mm wafer sizes.  The EV Group´s bond alignment systems offer highest precision, flexibility, ease of use and modular upgrade capability and have been qualified in numerous high throughput production environments. The precision of EV Group´s bond aligners accommodates most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.


Features

  • Supports bond alignment of double or triple wafer stacks up to 150 mm wafer sizes
  • Manual or motorized alignment stage
  • Fully motorized high resolution bottom side microscopes
  • Windows® based user interface
  • Quick tool change between different wafer sizes and different bonding applications
  • Options
    - Automatic alignment
    - IR alignment for inner substrate key alignment
    - NanoAlign® package for enhanced process capabilities
    - Available with system rack
    - Upgrade possibility to mask aligner