绝缘硅和图形化衬底
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键合机

   

EVG®20 IR Inspection Station

The EVG20 is designed for qualification of bond quality after pre-bonding.

   

EVG®301 Semi-automated Single Wafer Cleaning System

The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield.

   

EVG®320 Automated Single Wafer Cleaning System

The EVG320 Automated Single Wafer Cleaning System is designed for efficient removal of particles prior to critical process steps in semiconductor processing.

   

EVG®810LT LowTemp™ Plasma Activation System

The EVG810LT LowTemp™ plasma activation system is a single chamber, stand-alone unit for SOI, MEMS, compound semiconductors and advanced substrate bonding.

   

EVG®850 Automated Production Bonding System for SOI

The EVG850 is designed to fulfill a wide range of fusion wafer bonding applications, with main focus on SOI substrates manufacturing. The EVG850 is the only production bonding system built to operate in high throughput, high-yield environments.

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新闻和大事记

EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System

EVG集团向中国领先的晶圆代工厂交付300MM晶圆键合系统用于3D IC及高级芯片封装批量生产

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ECTC 2013

sensors expo & conference 2013

更多大事记 ..

TBDB_AD_Feb_13
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相关的产品

邏輯處理器/記憶體

SOI 晶圓

EV Group Unveils Industry's First Wafer Bonding System for 450mm SOI Semiconductor Wafers

技术文献

Product Range

EV Group Corporate Video

3D InCites reports on EVG Headquarters expansion and technology developments

参考文献