The heart of an SOI wafer is an ultra-thin, monocrystalline, conducting layer on a silicon wafer. On this isolated semiconductor layer of the microchip, all electronic operations take place. Today, wafer bonding is one of the most important manufacturing methods for SOI wafers. This technique found its way into industrial mass production, is cost efficient and production prove.
An essential contribution is achieved with the EVG850 production wafer bonder from EV Group. For this equipment EVG received the Austrian Innovation Award 2004 and was announced Austria’s most innovative company. With this EV Group contributes in the successful development of microprocessors in which the electrons reach their destination faster. These chips obtain higher switching frequencies, lower power consumption and avoid unwanted heat production. SOI chips have a 20%-30% higher performance and consume up to 1/3 less power than chips on conventional silicon.