Micro-Electro-Mechanical Systems (MEMS) is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology.
80µm SU-8 resist features with sidewall angles approaching 90°. Courtesy of DALSA Corporation.
MEMS Accelerometer. Courtesy of ST Microelectronics.
MEMS Gyroscope application. Courtesy of Apple.
Sub-µm high-aspect ratio structures created with DUV-Lithography. Courtesy of CEETAM.
NanoSpray coating, 100µm diameter and 300µm depth. Source EVG.
8-layer direct bond cross-section. Courtesy of MIT.
MEMS Microphone. Courtesy of Akustika.
Patterned, spray coated resist layer in anisotropically etched cavity. Courtesy of TU-Delft DIMES.
High-Q-3D solenoid industors for RF ICs. Courtesy of SIMIT.
Glass-frit bond interface. Courtesy of ST Microelectronics.
VLSIresearch announces THE BEST 2013 Suppliers
VLSIresearch announces winners of the 2013 10 BEST Suppliers of Chip Making Equipment awards
更多新闻 ..
ECTC 2013
sensors expo & conference 2013
更多大事记 ..
相关的产品
EV Group Capitalizes on MEMS Market Leadership, Further Diversifies Business
微流体技术
微機電元件
表面聲波元件
太陽光電
技术文献
Product Range
EV Group Corporate Video
3D InCites reports on EVG Headquarters expansion and technology developments
EVG in Top Five of the VLSIresearch 2012 Customer Satisfaction Survey