MEMS are intelligent, miniaturized 3D devices consisting of microelectronic components (integrated circuits) and micromechanical, optical, chemical, biochemical, or micro-optical components. MEMS technology is a rapidly emerging field with a high growth rate. Motion sensors, micro mirrors, microphones, gyroscopes, and accelerometers are just a few of the MEMS devices that are found in consumer applications such as cell phones, television sets, digital cameras, gaming devices and laptops.
Many MEMS devices require silicon wafer bonding to create a first level package - for example silicon or glass bonding - as a method to hermetically seal and encapsulate the device. The EVG wafer bonding systems are designed for volume manufacturing of MEMS and perform all wafer bonding techniques utilizing EVG's unique process separation principle. Various wafer sizes and materials with modular configurations for easy transfer of R&D processes to production are supported. EVG's wafer bonding equipment achieves the highest yields for aligned wafer bonding in the industry.