Microelectronic applications fabricated out of compound semiconductors as
well as silicon-based power devices basically require dedicated
manufacturing technologies offered by EVG.
Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding
EVG and NNFC announced results on improved transparent nanostructured anti-reflective coatings for next-gen displays
CS International 2017
IMAPS Device Packaging 2017
EV Group Corporate Video