Microelectronic applications fabricated out of compound semiconductors as well as silicon-based power devices basically require dedicated manufacturing technologies offered by EVG.
High-power LEDs redesigned to replace fluorescent and neon light sources and are used in surgical, traffic and automotive applications. Courtesy of LumiLeds Lighting. Sub-µm high-aspect ratio structurescreated with DUV-Lithography.Courtesy of CEETAM.
Cross-section SEM image of an InP/GaAs wafer pair bonded using a Au:Sn eutectic wafer bonding process. Source: EVG.
SEM Image showing an array of micromirrors. Micromirrors are combinations of microelectronic and optical components. Courtesy of Seoul National University.
Cross-section of temporary bond utilizing Brewer Science® 's HT seriesadhesive. Source: EVG.
Scanning Acoustic Microscope (SAM) image of an InP/GaAs wafer pair bonded using a Au:Sn eutectic wafer bonding process. Source: EVG.
EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System
EVG集团向中国领先的晶圆代工厂交付300MM晶圆键合系统用于3D IC及高级芯片封装批量生产
更多新闻 ..
ECTC 2013
sensors expo & conference 2013
更多大事记 ..
相关的产品
高亮度LED
表面聲波元件
技术文献
Product Range
EV Group Corporate Video
3D InCites reports on EVG Headquarters expansion and technology developments
EVG in Top Five of the VLSIresearch 2012 Customer Satisfaction Survey