Microelectronic applications fabricated out of compound semiconductors as
well as silicon-based power devices basically require dedicated
manufacturing technologies offered by EVG.
High-power LEDs redesigned to replace fluorescent and neon light sources and are used in surgical, traffic and automotive applications. Courtesy of LumiLeds Lighting.
Sub-µm high-aspect ratio structurescreated with DUV-Lithography.Courtesy of CEETAM.
Cross-section SEM image of an InP/GaAs wafer pair bonded using a Au:Sn eutectic wafer bonding process. Source: EVG.
SEM Image showing an array of micromirrors. Micromirrors are combinations of microelectronic and optical components. Courtesy of Seoul National University.
Cross-section of temporary bond utilizing Brewer Science® 's HT seriesadhesive. Source: EVG.
Scanning Acoustic Microscope (SAM) image of an InP/GaAs wafer pair bonded using a Au:Sn eutectic wafer bonding process. Source: EVG.
EV Group Establishes Nanoimprint Lithography Competence Center for Photonic Applications
SEMICON Russia 2015
EV Group Corporate Video
3D InCites reports on EVG Headquarters expansion and technology developments