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先进封装，三维层叠互联
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光刻技术

EVG®101 Advanced Resist Processing System

The EVG101 series perform R&D type processes on a single chamber design, which is fully compatible with our automated systems."

EVG®101LA Large Area Coating System

The EVG101LA Large Area Coating System is designed for cost effective coating on large areas.

EVG®120 Automated Resist Processing System

The EVG120 is an economical tool for quality spin coating and develop processes, especially for standard photoresist applications.

EVG®150 Automated Resist Processing System

Designed to provide the widest range of process variations, the EVG150 series' modularity accepts spin and spray coating, developing, bake and chill modules to suit your individual production requirements.

EVG®150N Automated NanoSpray Coating System

NanoSpray allows a new bandwidth of applications throughout many technologies in semiconductor processing markets.

EVG®40 Top-to-bottom side Measurement System

EV Group offers systems for highly accurate destruction-free alignment accuracy measurements designed for all processes that involve double sided lithography.

EVG®620 Automated Mask Alignment System

Automated Mask Alignment System designed for optical double-side lithography. Volume production types and manual R&D systems are available."

EVG®6200∞ Automated Mask Alignment System

With full field proximity exposure of very thick resist layers, the EVG6200 Infinity targets wafer bumping and chip scale packaging markets as well as applications in MEMS, Compound Semiconductor, Power Devices and Nanotechnology."

EVG®770 Automated NIL Stepper

EV Group's NIL Stepper is designed for step and repeat large area UV-Nanoimprint Lithography (UV-NIL) processes compatible for 100 mm up to 300 mm wafers.

Hercules® Lithography Track System

The Hercules is a unique platform with spin coat, bake, chill, align/expose and develop modules, all arranged in one production system.

IQ Aligner® Automated Mask Alignment System

The IQ Aligner is based on a field-proven, robust design with up to 300 mm wafer size capability, full-field exposure, single and double-side alignment, large gap and dark field mask alignment.

IQ Aligner® Automated UV-NIL, µ-CP System

The IQ Aligner Automated UV-NIL, µ-CP System allows for micromolding and nanoimprinting processes with stamps and wafers from 150 mm to 300mm diameter.

键合机

EVG®20 IR Inspection Station

The EVG20 is designed for qualification of bond quality after pre-bonding.

EVG®510 Semi-automated Wafer Bonding System

The EVG510 is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp™ plasma bonding.

EVG®520IS Semi-automated Wafer Bonding System

The EVG520IS is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp™ plasma bonding.

EVG®540 Automated Wafer Bonding System

The EVG540 is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications.

EVG®540C2W Automated Wafer & Chip-to-Wafer Bonding System

The EVG540C2W is designed for permanent bonding on chips to wafer (C2W) on wafer scale.

EVG®560 Automated Wafer Bonding System

The EVG560 accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm.

EVG®620 Automated Bond Alignment System

Known for its high level of automation and reliability, the EVG620 Automated Bond Alignment System is designed for wafer-to-wafer alignment up to 150 mm wafer sizes.

EVG®6200∞ Automated Bond Alignment System

The EVG6200 Automated Bond Alignment System is designed for wafer-to-wafer alignment for subsequent wafer bonding applications up to 200 mm wafer sizes.

EVG®810LT LowTemp™ Plasma Activation System

The EVG810LT LowTemp™ plasma activation system is a single chamber, stand-alone unit for SOI, MEMS, compound semiconductors and advanced substrate bonding.

EVG®850 Automated Production Bonding System for SOI

The EVG850 is designed to fulfill a wide range of fusion wafer bonding applications, with main focus on SOI substrates manufacturing. The EVG850 is the only production bonding system built to operate in high throughput, high-yield environments.

EVG®850DB Automated Debonding System

The EVG850DB Automated Debonding System is designed for automated debonding of device wafer from the carrier substrate.

EVG®850TB Automated Temporary Bonding System

The EVG850TB bonds compound semiconductor wafers to sapphire, quartz or silicon carriers by use of dry film, spin-on adhesives, or wax.

Gemini® Automated Production Wafer Bonding System

SmartView® Bond Alignment System for Universal Alignment

The SmartView Alignment System offers a proprietary method for micron level face-to-face wafer level alignment

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新闻和大事记

EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System

EVG集团向中国领先的晶圆代工厂交付300MM晶圆键合系统用于3D IC及高级芯片封装批量生产

更多新闻 ..

sensors expo & conference 2013

更多大事记 ..

TBDB_AD_Feb_13

更多

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EV Group and Fraunhofer IZM-ASSID Establish JDA for High-Volume 3D Integration Applications

EV Group Corporate Video

3D InCites reports on EVG Headquarters expansion and technology developments

参考文献

3D InCites reports on EVG Headquarters expansion and technology developments