Wafer level packaging employs specific alignment and wafer bonding
techniques as an enabling solution for stacking of wafers and
three-dimensional integration of devices.
Courtesy of Enthone.
80µm SU-8 resist features with sidewall angles approaching
Courtesy of DALSA Corporation.
High-Q-3D solenoid industors for RF ICs. Courtesy of
Sub 0.5µm aligned, bonded color filter. Courtesy of
MicroEmissive Displays (MED).
Micro-lens structures for CMOS image sensor modules created
utilizing UV-NIL. Source EVG.
Ziptronix direct bond interconnect. Courtesy of Ziptronix.
NanoSpray coating, 100µm diameter and 300µm depth. Source
Patterned, spray coated resist layer in anisotropically
etched cavity. Courtesy of TU-Delft DIMES.
Cross-section of temporary bond utilizing Brewer Science's
adhesive. Source: EVG.
200mm chip-to-wafer bond. Courtesy of Datacon.
Metal/Adhesive via first 3D bonding interface. Courtesy of
EV Group Extends Volume Manufacturing Expertise to Biotechnology and Medical Device Applications
Leti Orders HERCULES NIL System from EV Group for Joint Nanoimprint Lithography Program
SEMICON EUROPA 2016
MEMS & Sensors Executive Congress 2016
EV Group and Fraunhofer IZM-ASSID Establish JDA for High-Volume 3D Integration Applications
EV Group Corporate Video