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Growth In Engineered Substrate Market For Power Device And Radio Frequency Applications Driving Demand For EV Group Wafer Bonding Solutions

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ST. FLORIAN , Austria, December 16, 2015 —EV Group (EVG) today announced that the company has seen a significant increase in demand for its wafer bonding solutions for engineered substrates over the past year. This rise in demand is driven in part by the rapid growth in the power electronics and radio frequency (RF) device markets - where engineered substrates offer key performance benefits, such as high carrier mobility and reduced power loss/leakage, due to their unique material properties.


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EVG received a Best in MEMS & Sensors Innovation (MEMsies) Award

Thumbnail_MEMS LogoST. FLORIAN, Austria, November 5, 2015 - During this year's MEMS Executive Congress hosted by the MEMS & Sensors Industry Group (MIG) in Napa Valley on November 4-6, EVG received a Best in MEMS & Sensors Innovation (MEMsies) Award for MEMS/Sensors Supplier of the Year.

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先进封装和3D-IC技术市场的繁荣推动EVG集团300毫米聚合体自动晶圆键合系统的销量大幅扩展

 

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2015年8月31日,奥地利的圣弗洛里安 ——作为 MEMS 、纳米技术和半导体市场中主要晶圆键合和光刻设备供应商的 EVG 集团,今日称其 300 毫米聚合体自动晶圆键合系统需求旺盛。过去 12个月,该系统新增订单量已翻一番,其中包括 EVG ®560 GEMINI ® EVG ®850 TB/DB在内的一系列晶圆键合机。这些订单来自不同性质的企业,包括总部位于亚洲的业内领先半导体专业封测代工(OSAT)供应商。系统需求量的大幅增长离不开先进封装技术的应用,制造商加大了CMOS图像传感器和采用2.5D 3D-IC 硅通孔( TSV )互连技术的垂直堆叠半导体的生产。


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EVG集团将融入纳米压刻光刻技术的HERCULES NIL集成追踪系统应用于大批量生产制造

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2015 7 7 日,奥地利的圣弗洛里安 —— 作为 MEMS 、纳米技术和半导体市场中主要晶片键合和光刻设备供应商的 EVG 集团今天揭开了高集成追踪系统的面纱。它将清理、涂光刻胶和烘焙预处理步骤和 EVG 公司专利 SmartNIL™ 中的大面积纳米压制光刻技术 (NIL) 应用步骤集合与一个平台上。具备工业领先的生产力和吞吐量的 HERCULES NIL 为生产制造大批量的最新光子设备提供了彻底、专门的解决方案。它通过调整从十几个纳米到几微米大小的压印结构体的尺寸,改变和提升了装置和设备的光感应,应用于制造 LED 灯和其他设备过程使用的抗反射涂层、颜色、偏光镜、导光板、图形化衬底制备工艺之中。其他快速兴起、应用 NIL 的设备包括 MEMS NEMS 、生物、纳电子设备。


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EV GROUP organizes Photonics Workshop in Conjunction with MICRO AND NANO ENGINEERING (MNE) Conference  

MNE_ThumbnailST.FLORIAN, Austria, August 25, 2015 - EV Group (EVG) will host a special session at the 41st Micro and Nano Engineering (MNE 2015) conference – a leading international conference on micro- and nanofabrication and manufacturing using lithography and related techniques. The first EVG Photonics Workshop will take place at the World Forum in The Hague, The Netherlands, during the afternoon of the opening day of MNE 2015 on Monday, September 21.

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EV Group Receives 3D InCites Award for GEMINI FB XT Automated Fusion Wafer Bonder  

2015_07_3DIC_LogoST. FLORIAN, Austria, July 30, 2015-EV Group (EVG) today announced that it has received a 2015 3D InCites award for its GEMINI®FB XT automated fusion wafer bonder in the category of 3D manufacturing equipment. Hosted by 3D InCites, an online media resource founded in 2009 to stir up interest in 3D IC integration and 3D packaging technologies, the 3D InCites Awards program recognizes achievements to further the commercialization of 3D integration technologies.

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Leti and EVG Launch INSPIRE, a Lithography Program Aimed At Demonstrating Benefits of Nano-imprint Technology

2015_07_INSPIRE_ThumbnailGRENOBLE, France, and ST. FLORIAN AM INN, Austria - July 15, 2015 - CEA-Leti and EV Group have launched a new program in nano-imprint lithography (NIL) called INSPIRE to demonstrate the benefits of the versatile, powerful nano-patterning technology and spread its use for applications beyond semiconductors.

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EV Group Achieves Third Consecutive Triple Crown Win in 2015 VLSIresearch Customer Satisfaction Survey  

2015_05_VLSI_indexST. FLORIAN, AUSTRIA, July 14, 2015 - EV Group (EVG) announced that for a third year in a row, it has earned all three coveted awards from VLSIresearch's annual customer satisfaction survey. EVG has again been ranked as one of the 10 BEST Focused Chip Making Equipment Suppliers, as well as one of the 2015 THE BEST Suppliers of Fab Equipment. Additionally, EVG was distinguished with a 2015 RANKED 1st award in the Other Fab Equipment category.

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EV Group Ramps Nanoimprint Lithography into High-Volume Manufacturing with HERCULES® NIL Track System  

2015_07_HERCULES_NIL_ThumbnailST. FLORIAN, Austria, July 7, 2015-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the HERCULES® NIL-a fully integrated track system that combines cleaning, resist coating and baking pre-processing steps with EVG's proprietary SmartNIL™ large-area nanoimprint lithography (NIL) process in a single platform.

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EV Group NILPhotonics™ Competence Center Sees Strong Customer Demand for Emerging Photonic Applications

201505_NILPhotonics_milestone 120px ST. FLORIAN, Austria, May 19, 2015-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that its NILPhotonics™ Competence Center-established to assist customers in enabling new and enhanced products and applications in the field of photonics-has generated strong interest from customers and resulted in multiple system orders since its launch in December 2014.

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EVG延续在高真空晶片键合工艺技术上的领导地位

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EVG 集团是一家为微电子机械系统、纳米技术以及半导体市场提供晶片键合以及光刻技术设备的全球领先供应商。 2015 3 16 日在奥地利的圣弗洛里安, EVG 集团现为全自动高真空共晶键合设备的 EVG ®580 ComBond ® 系列推出了两款新的配置。根据大学、研究所和批量生产商的不同需求,这两款配置能够在室温下实现不同晶格常数和不同热膨胀系数的材料导电的无氧化键合。


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