Company Increases Production Capacity In Light Of Strong Order
ST. FLORIAN, AUSTRIA, April 22, 2009 - EV
Group (EVG), a leading supplier of wafer bonding and lithography equipment
for the MEMS, nanotechnology and semiconductor markets, today announced
that the company will increase its production capacity in light of strong
order intake in its first half year of fiscal 2009. In fact, EV Group
plans to introduce an additional production shift later this month to
extend its normal hours of operation to meet delivery targets. Ended
March 31, the company witnessed a rise in order intake exceeding forecasted
expectations through Q2 '09 driven by continued demand from the burgeoning
3D IC/through-silicon via (TSV) and nanoimprint lithography markets.
Commenting on today's announcement, Dr. Werner Thallner, EV Group's
Executive Operations Director, noted, "We are taking measures to ramp up
production to not only meet current demand but also future demand, which we
expect to remain strong despite the current economic situation.
Meeting our delivery targets is an essential part of our business, and an
ongoing commitment to our customers. An additional production shift
will prepare us for future growth and enable us to shorten lead times that
will in turn allow our customers to quickly ramp production and meet their
Despite the current global economic slowdown, EV Group remains optimistic
about its outlook for 2009 and beyond. This is the result of the company's
diversified technology, process and equipment portfolio as well as its
ongoing, substantial investment in R&D and close cooperation with
industry partners, universities and research institutions.
Advanced, cost-effective production equipment and superior process
capabilities, quality and support make EVG the partner of choice, both in
R&D and high-volume production environments. The company
maintains dominant share of the market for wafer bonding equipment, and is
a market and technology leader in lithography for advanced packaging and
About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for
semiconductor, MEMS and nanotechnology applications. Through close
collaboration with its global customers, the company implements its
flexible manufacturing model to develop reliable, high-quality,
low-cost-of-ownership systems that are easily integrated into customers'
fab lines. Key products include wafer bonding,
lithography/nanoimprint lithography (NIL) and metrology equipment, as well
as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG
holds a leading position in NIL and lithography for advanced packaging and
MEMS. Along these lines, the company co-founded the EMC-3D consortium
in 2006 to create and help drive implementation of a cost-effective
through-silicon via (TSV) process for major ICs and MEMS/sensors.
Other target semiconductor-related markets include silicon-on-insulator
(SOI), compound semiconductor and silicon-based power-device
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates
via a global customer support network, with subsidiaries in Tempe, Ariz.;
Albany, N.Y.; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li,
Taiwan. The company's unique Triple i-approach (invent - innovate -
implement) is supported by a vertical integration, allowing EVG to respond
quickly to new technology developments, apply the technology to
manufacturing challenges and expedite device manufacturing in high
volume. More information is available at www.EVGroup.com.
EV Group Contacts:
Director, Marketing and Communications
Tel: +43 7712 5311 0
Tel: +1-650-968-8900, ext. 108