EV Group realizes strong first half year in fiscal 2009

Company Increases Production Capacity In Light Of Strong Order Intake

ST. FLORIAN, AUSTRIA, April 22, 2009 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the company will increase its production capacity in light of strong order intake in its first half year of fiscal 2009.  In fact, EV Group plans to introduce an additional production shift later this month to extend its normal hours of operation to meet delivery targets.  Ended March 31, the company witnessed a rise in order intake exceeding forecasted expectations through Q2 '09 driven by continued demand from the burgeoning 3D IC/through-silicon via (TSV) and nanoimprint lithography markets.

Commenting on today's announcement, Dr. Werner Thallner, EV Group's Executive Operations Director, noted, "We are taking measures to ramp up production to not only meet current demand but also future demand, which we expect to remain strong despite the current economic situation.  Meeting our delivery targets is an essential part of our business, and an ongoing commitment to our customers.  An additional production shift will prepare us for future growth and enable us to shorten lead times that will in turn allow our customers to quickly ramp production and meet their time-to-market objectives."

Despite the current global economic slowdown, EV Group remains optimistic about its outlook for 2009 and beyond. This is the result of the company's diversified technology, process and equipment portfolio as well as its ongoing, substantial investment in R&D and close cooperation with industry partners, universities and research institutions.

Advanced, cost-effective production equipment and superior process capabilities, quality and support make EVG the partner of choice, both in R&D and high-volume production environments.  The company maintains dominant share of the market for wafer bonding equipment, and is a market and technology leader in lithography for advanced packaging and nanotechnology.

About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications.  Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines.  Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS.  Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors.  Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan.  The company's unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.  More information is available at www.EVGroup.com.


EV Group Contacts:
Clemens Schütte
Director, Marketing and Communications
EV Group
Tel: +43 7712 5311 0
E-Mail: Marketing@EVGroup.com

Karen Do
Account Manager
MCA, Inc.
Tel: +1-650-968-8900, ext. 108
E-mail: kdo@mcapr.com

 

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