SEOUL, SOUTH KOREA / ST. FLORIAN, AUSTRIA, January 20,
2009 – EV Group (EVG), a leading supplier of wafer bonding and
lithography equipment for the MEMS, nanotechnology and semiconductor
markets, today announced that leading Korean components manufacturer,
Samsung Electro-Mechanics Co., LTD. (SEMCO), selected the company’s
EVG810LT, a LowTemp® plasma activation system, for its R&D work
involving stacked and 3D MEMS devices. The tool will be shipped and
installed in March 2009, following successful demonstrations at EVG’s clean
room facility in Austria.
The EVG810LT is a single chamber, stand-alone plasma activation system for
low-temperature bonding for up to 200-mm wafers. EVG’s revolutionary plasma
activation technology enables high-surface energy bonding at the
fusion/molecular and intermediate layers, resulting in bonds with fracture
strengths exceeding bulk silicon at shorter annealing times. Its
low-temperature, closed-chamber design offers bond surface uniformity
across a wide range of thermal-sensitive materials, including silicon-based
semiconductors, compound semiconductors, glass and polymers. The low
annealing temperate—ranging from room temperature up to 400°C—results in
stress-free, warp-free, aligned substrates, ultimately lowering packaging
costs for MEMS devices.
“We are committed to bringing leading-edge MEMS devices to market, and in
doing so, are focused on improving the quality and performance of
next-generation 3D and stacked MEMS devices,” said Dr. Jae Woo Joung,
general manager of Samsung Electro-Mechanics Co., LTD. “In turn, we’re
looking to partner with companies that can deliver the latest manufacturing
approaches, process expertise and support to help us realize our goals. EV
Group’s plasma activation technology proved to meet our stringent
requirements—offering the high reliability and high-quality processing
results we demand for our products.”
Dr. Weonsik Yang, general manager at EV Group Korea Ltd. noted, “As the
Korean market continues to increase its technological developments and rise
to compete in the global MEMS arena, EVG is excited to have the opportunity
to work closely with an industry innovator and leader, such as Samsung
Electro-Mechanics Co., LTD. We are extremely dedicated to enabling our
customers in this region, and look forward to future collaborative efforts
with SEMCO.”
About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for
semiconductor, MEMS and nanotechnology applications. Through close
collaboration with its global customers, the company implements its
flexible manufacturing model to develop reliable, high-quality,
low-cost-of-ownership systems that are easily integrated into customers’
fab lines. Key products include wafer bonding, lithography/nanoimprint
lithography (NIL) and metrology equipment, as well as photoresist coaters,
cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG
holds a leading position in NIL and lithography for advanced packaging and
MEMS. Along these lines, the company co-founded the EMC-3D consortium in
2006 to create and help drive implementation of a cost-effective
through-silicon via (TSV) process for major ICs and MEMS/sensors. Other
target semiconductor-related markets include silicon-on-insulator (SOI),
compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates
via a global customer support network, with subsidiaries in Tempe, Ariz.;
Albany, N.Y.; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li,
Taiwan. The company's unique Triple i-approach (invent - innovate -
implement) is supported by a vertical integration, allowing EVG to respond
quickly to new technology developments, apply the technology to
manufacturing challenges and expedite device manufacturing in high volume.
More information is available at www.EVGroup.com.
EV Group Contacts:
Clemens Schütte
Director, Marketing and Communications
EV Group
Phone: +43 7712 5311 0
E-Mail: Marketing@EVGroup.com
Marie Labrie
Vice President
MCA, Inc.
Tel: +1-650-968-8900, ext. 119
E-mail: mlabrie@mcapr.com