ST. FLORIAN, Austria and INDIANAPOLIS, Ind., June 17, 2013-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, and Dynaloy, LLC, an international manufacturer of chemicals for the electronics industry and wholly owned subsidiary of Eastman Chemical Company, today introduced CoatsClean™-an innovative single-wafer photoresist and residue removal technology designed to address thick films and difficult-to-remove material layers for the 3D-ICs/through-silicon vias (TSVs), advanced packaging, microelectromechanical systems (MEMS) and compound semiconductor markets. CoatsClean provides a complete wafer cleaning solution that offers significant efficiency, performance and cost-of-ownership (CoO) advantages compared to traditional resist stripping and post-etch residue removal methods.
"Increasing wafer processing challenges associated with the adoption of new materials,
device architectures and packaging schemes requires a new, holistic view of wafer cleaning, where the chemistry, process and equipment are all critically important and must be addressed in combination," stated Steven Dwyer, business director at Dynaloy. "We're pleased to be working with EV Group on developing and commercializing CoatsClean technology to meet the needs of our customers for a more cost-effective, flexible approach to thick-film resist removal."
CoatsClean incorporates a number of key features to boost performance and productivity, as well as reduce CoO, compared to wet bench and other traditional wafer cleaning approaches. The CoatsClean process and chemical formulation are engineered to perform at higher temperatures, resulting in faster stripping rates and cycle times. This enables CoatsClean to operate as a single-wafer process for thick resist films and difficult-to-remove resists-resulting in improved performance, consistency, reproducibility and repeatability. The engineered formulation also enables selective stripping of the resist.
CoatsClean is also unique in its ability to dispense a small amount of material on the top of the wafer, and then activate the material with direct heat. This direct utilization of the material and heat dramatically reduces the strip material used. CoatsClean uses fresh solution for each processed wafer compared to competing techniques that use an immersion bath-resulting in greater process efficiency and eliminating cross contamination. The highly selective application of resist strip material eliminates damage to the wafer backside. The entire CoatsClean process is performed in a single bowl, which reduces tool footprint.
"CoatsClean applies the right chemistry at the right process conditions to provide optimal cleaning results," stated Paul Lindner, EV Group's executive technology director. "By combining our respective strengths, EV Group and Dynaloy can now offer our customers a complete wafer cleaning solution that significantly reduces their CoO and achieves superior performance."
The CoatsClean tool series, which includes EV Group's EVG301RS and EVG320RS XT platforms, leverage EV Group's core competencies in controlled dispense, heating and temperature control, fluid rinse and wafer handling technologies. The EVG301RS system targets research and development, as well as low-volume production on substrates up to 300 mm in diameter, while the EVG320RS XT features up to eight process modules to address high-volume production requirements on substrates up to 300 mm in diameter. The systems are highly modular in design to allow for a wide range of configurations and combinations of chemicals.
EV Group will be responsible for selling the CoatsClean systems and providing customer support, while Dynaloy will be responsible for selling the CoatsClean resist stripping materials. CoatsClean systems have already been installed for customer demonstrations, and EVG and Dynaloy are now accepting orders for the systems and resist stripping materials.
Founded in 1965, Dynaloy, LLC has grown from a small regional provider of electronic cleaning chemistries to what is now an international manufacturer of chemicals for the electronics industry-with superior material science, analytics, and technical capabilities. A wholly owned subsidiary of Eastman Chemical Company, Dynaloy combines the responsiveness of a small company with the market knowledge, material science expertise, and vast resources of a world leader in chemical manufacturing. And as part of a global organization, Dynaloy is committed to finding innovative approaches that lead to practical solutions. Equipped with a state-of-the-art product development lab and clean room, the manufacturing facility in Indianapolis, Indiana is designed to enhance the kind of creative thought that facilitates beneficial product design, heightens reliability, and fosters unparalleled customer service. More information about Dynaloy is available at www.dynaloy.com .
About EV Group (EVG)
EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors and power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.
® 320RS XT Automated Resist Stripping System
CoatsClean™ technology development is specifically targeting the emerging needs of wafer level packaging: removing thick, highly cross-linked films such as photoresists and fluxes while maintaining the pre-clean integrity of the solder bump, exposed metals, under-bump metallization, and dielectric layers. Representative examples of cleaning performance
Post etch residue cleaning after TSV etch process; left: before cleaning, right: after cleaning
Courtesy of Dynaloy LLC
SEM images of PV strip process - left: unstripped showing photoresist (top layer) and polyimide (bottom layer); right: after the CoatsCleanTM strip showing only the polyimide layer
Post etch residue cleaning after
GaAs etch process top: before cleaning bottom: after cleaning
Courtesy of Dynaloy