新闻档案 2012

EV Group Completes Cleanroom Expansion, Opens New R&D Labs and Customer Training Center at Corporate Headquarters

2012_11EVGCleanroomNew  ST. FLORIAN, Austria, November 27, 2012 - EV Group (EVG) announced the completion of its newly expanded cleanroom IV facility at its corporate headquarters in Austria.  As part of the company's long-term growth strategy to address high-volume tool orders and speed time to market for its worldwide customer base, EV Group doubled its cleanroom space for process development and pilot production services.

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Texas State University Selects EV Group Wafer Bonding System for Advanced Compound Semiconductor and Silicon-Based Power Device Research

2012_11EVG501  ST. FLORIAN, Austria and SAN MARCOS, Texas, U.S., November 13, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has installed an EVG501 wafer bonding system to Texas State University.  The highly flexible R&D system, which is configurable for a variety of wafer bonding processes, has been installed in the university's cleanroom facilities to support advanced compound semiconductor and silicon-based power device research and development.

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EV Group Commands Leadership Position in MEMS Market

  2012_11openhouse  TEMPE, Ariz., November 6, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today highlighted a succession of milestones in the MEMS arena, where the company continues to strengthen its market share.  In 2012, MEMS represented 48 percent of the company's North American sales, up 13 percent from 2011, thanks to strong growth in the mobile device and automotive sensor markets.

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How EV Group jumped to 4th place

vlsiresearchlogo   SANTA CLARA, CA, October 8, 2012 - 2012 was the first time EV Group (EVG), a wafer bonding and lithography equipment supplier, captured a top five spot in VLSIresearch's 2012 Customer Satisfaction Survey. This was a significant accomplishment because EVG has been growing by leaps and bounds with a combination of excellent products and the fast-growing MEMS and 3D IC semiconductor markets. EVG grew not only in revenues, but they also doubled their production capacity. 

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中国SOI晶圆制造商沈阳硅基科技有限公司购买EVG集团EVG850LT 300-MM SOI晶圆键合系统

2011_11_EVG850SOI   2012年10月9日,奥地利圣弗洛里安市讯 世界领先的微机电系统( MEMS )、纳米技术和半导体市场晶圆键合与光刻设备供应商 EVG 集团 (EVG) 今天宣布,沈阳硅基科技有限公司( SST )已成功安装 EVG850LT 300-mm 低温自动产品键合系统,用于绝缘硅片( SOI )材料的制造。继 先前购买 200-mm EVG850LT 之后,这家中美合资 SOI 晶圆厂商再次购买了 300-mm 键合机。该系统已于 2010 9 月发货至 SST 最先进的工厂,标志着中国 300-mm SOI 晶圆产品工具的首次安装。

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EV Group's ZoneBOND® Temporary Bonding/Debonding Technology Makes First Foray Into Compound Semiconductor Market

2011_10_ZoneBOND  ST. FLORIAN, Austria, September 24, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order for its EVG850 temporary bonding/debonding (TB/DB) systems from a leading maker of compound semiconductor-based components. 

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EVG發表新一代EVG150自動化光阻製程系統 為高產能塗佈/顯影應用提供理想平台

2012_09EVG150preview   

微機電系統 (MEMS) 、奈米技術與半導體晶圓接合與微影技術設備領導廠商 EV Group (EVG) 宣布,將於 9 5 日至 7 日登場的 SEMICON Taiwan 2012 國際半導體展中 發表新一代 EVG150 自動化光阻製程系統 。全新設計的高產能光阻塗佈 / 顯影設備可以提供客戶一個高靈活度的模組化平台,可在同一機台結合旋轉式塗佈顯影製程和 EVG 先進的專利型噴霧式塗佈技術。


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EV Group's GEMINI® Wafer Bonding System First to Pass Equipment Maturity Assessment within SEMATECH's 3D Interconnect and Manufacturability Program

2012_07_10Sematech  SEMICON WEST, San Francisco, Calif., July 10, 2012 - EV Group (EVG) today announced that its GEMINI® Automated Wafer Bonding System has become the first product to pass a systematic, rigorous Equipment Maturity Assessment (EMA) implemented within SEMATECH's 3D Interconnect program and ISMI's EMA team.

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EV Group and Brisbane Materials Technology Introduce Breakthrough Anti-Reflective Coating Solution to Boost Power Output of Photovoltaics

2012_07_09brismat    INTERSOLAR NORTH AMERICA, San Francisco, Calif., July 9, 2012 - EV Group (EVG), a leading supplier of coating equipment for the photovoltaics (PV), nanotechnology and semiconductor markets, and Brisbane Materials Technology (BMT), a specialty materials company, today announced they are collaborating to provide a total solution for anti-reflective (AR) coatings for the PV market.

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EV Group Unveils Next-Generation Temporary Bonding and Debonding Platform for High-Volume 3D IC Manufacturing

   thumbnail_overview_EVG850TBDB-(XT-Frame)-bg  ST. FLORIAN, Austria, July 3, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®850TB/DB automated temporary bonding and debonding system built on the company's new XT Frame platform, which has been optimized to support thin-wafer processing for high-volume 3D IC and TSV (through silicon via) manufacturing. 

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A*Star Institute of Microelectronics Announces MEMS Consortium Phase II to Pave the Way for High Volume Manufacturing

  2012_06_ime  A*STAR Institute of Microelectronics (IME) has announced the launch of its Micro-Electro-Mechanical-Systems (MEMS) Consortium Phase II, to accelerate MEMS technology into markets driven by strong demand for next generation mobile devices.

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EV Group Receives First-ever Ranking Among Top Five VLSIresearch 10 BEST Suppliers of Chip Making Equipment

2012_05_vlsi  ST. FLORIAN, AUSTRIA, May 24, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that for the first time, its customers have ranked EVG as one of VLSIresearch's top five 10 BEST Focused Suppliers of Chip Making Equipment companies in the market research firm's extensive customer satisfaction survey results for 2012. 

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Himax Technologies Selects EV Group to Expand Production Capacity for Wafer-Level Optics

thumbnail_overview_IQ_Aligner  ST. FLORIAN, AUSTRIA, March 27, 2012 - EV Group (EVG) today announced that Himax Technologies, Inc., a leading producer of CMOS image sensors, power management devices and semiconductor devices and components used in flat panel displays, has placed a repeat order for an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EVG. 

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Shin-Etsu MicroSi Joins EV Group's Open Platform for Temporary Bonding Materials for 3D IC Manufacturing

   2012_03_ZoneBondOpenPlatform  ST. FLORIAN, Austria and TOKYO, Japan, March 14, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shin-Etsu Chemical Co., Ltd., the world's largest supplier of semiconductor materials, has joined EVG's open platform for temporary bonding/debonding (TB/DB) materials.

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Tokyo Institute of Technology Installs EV Group Wafer Cleaning System for Advanced Optical IC Research and Development

  2012_03_EVG301_200mm  TOKYO, Japan, March 1, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has shipped an EVG301 semi-automated single-wafer cleaning system to Tokyo Institute of Technology (Tokyo Tech).  The EVG301 has already been installed at Tokyo Tech's Arai-Nishiyama Lab, and is being used in the research and development of advanced optical communication ICs. 

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EV集团推出第二代EVG620HBL LED生产光罩定位系统

overview_EVG620HBLGenIIschwarz   

2012 2 7 —— 晶圆键合及光刻设备领先的供应商 EV 集团 ——主要为先进 半导体及封装、化合物半导体, 微电子机械系统,绝缘硅片( SOI )以及新兴的纳米技术市场供应产品,今天发布 EVG620HBL Gen II—— 第二代全自动 掩模对准系统 ,实现了 高亮度发光二极管的批量生产。 第一代 EVG620HB L 发布一年后, Gen II 工具平台的推出满足了 HB-LED 客户的特定需求,以及市场一直以来对降低总所有权成本的需求。此外, EVG620HBL Gen II 优化了晶圆厂的工具封装 —— 与竞争产品相比,每平方米洁净室空间的晶圆产出量提高了 55%


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EV Group Signs Collaboration Agreement with Eulitha to Establish Low-Cost-of-Ownership Nanopatterning Solutions for HB-LED Manufacturing

EVG_EulithaPHABLEpreview  ST. FLORIAN, Austria, January 10, 2012 - EV Group (EVG) today announced that it has signed a joint-development and licensing agreement with Eulitha AG, a pioneer and leader in the production of high-quality nanostructures using advanced lithography techniques.  EVG will integrate Eulitha's PHABLE™ mask-based ultraviolet (UV) photolithography technology with EVG's automated mask aligner product platform.

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