新闻档案 2011

Asahi Kasei Orders IQ Aligner UV-NIL System from EV Group for Advanced Materials Development for High-Resolution Wafer-Level Optics

thumbnail_overview_IQ_Aligner   SEMICON JAPAN, CHIBA CITY, Japan, December 6, 2011 - EV Group (EVG) today announced that Asahi Kasei E-Materials Corporation, the core operating company of the Asahi Kasei Group for electronics materials, energy materials, photosensitive materials and epoxy resins, has purchased an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EVG.  

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EV Group Boosts High-Volume Manufacturing Performance across Product Lines with New XT Frame Equipment Platform

thumbnail_EVG850TBDB-(XT-Frame)-white-bg    ST. FLORIAN, Austria, December 5, 2011 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has introduced a new equipment platform, dubbed the XT Frame, that extends process throughput and tool functionality for virtually all of its current volume-manufacturing product offerings.

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上海新傲科技公司继续订购EVG晶圆片键合机,迈入先进的全自动SOI晶圆生产模式

  2011_11_EVG850SOI  2011 11 9 奥地利圣 弗洛里安市讯 —— 今天 世界领先的微机电系统、纳米技术和半导体市场 晶圆键合 与光刻设备供应商 EVG 宣布 中国领先的晶圆制造商之一 上海新傲科技有限公司 以下简称 新傲 向其下达了一份用于硅绝缘体 SOI 和晶片直接键合的 EVG850 自动化生产键合系统 后续订单

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EV Group Launches ZoneBOND™ Capable Equipment and Open Platform for Temporary Bonding Materials

2011_10_ZoneBOND_gemini  ST. FLORIAN, Austria, October 26, 2011- EV Group (EVG) today announced that it has launched a suite of groundbreaking temporary bonding and debonding (TB/DB) equipment modules that support ZoneBOND™ technology.  In parallel, EVG has opened its TB/DB equipment platform to enable the use of a wide range of adhesives from various suppliers to give customers the most flexible choice of bonding materials. 

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Brewer Science and EV Group Announce Agreement on ZoneBOND™ Technology

   2011_10_ZoneBOND  ROLLA, MO, USA and ST. FLORIAN, AUSTRIA, October 20, 2011 - Brewer Science, Inc., a global leading innovator and manufacturer of specialty materials, process solutions, and equipment for the microelectronics industry, and EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today announced an agreement on ZoneBOND™ technology.

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EV Group and Fraunhofer IZM-ASSID Establish Joint Development Agreement for High-Volume 3D Integration Applications

  2011_10_assid  SEMICON EUROPA, Dresden, Germany, October 11, 2011-EV Group (EVG) today announced that it has established an agreement with world-renowned research institute Fraunhofer IZM-ASSID to jointly develop high-volume manufacturing processes for 3D IC integration applications. 

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EV Group Launches New Flagship Model in its GEMINI® FB Family of Fusion Wafer Bonding Systems to Enhance Throughput and Automation Performance

EVG_GeminiFB  ST. FLORIAN, Austria, Sept. 7, 2011 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is launching a new flagship model in its field-proven GEMINI FB fusion wafer bonding family that increases system throughput to up to 20 wafers per hour. 

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EV Group Breaks Ground for Headquarters Expansion due to Increased Customer Demand

  EVG_Spatenstich_thumbnail   ST. FLORIAN AM INN, July 27, 2011-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it broke ground on expanding the company's manufacturing capacity at its headquarters in Austria earlier this month.  This expansion is the latest example of the company's continued steady growth since its foundation more than 30 years ago. 

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Prototype Tools for Mass Producing Nanostructures to Launch in Singapore

a-star_logo  Singapore, 27 July 2011 - The Industrial Consortium On Nanoimprint (ICON), which is helmed by the Institute of Materials Research and Engineering (IMRE), a research institute of Singapore’s Agency for Science, Technology and Research (A*STAR), is ready to put roll-to-roll nanoimprint manufacturing to the test.

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SEMATECH Reports Stellar Results for 1st 450-mm Wafer Using EV Group's Nanoimprint Technology

2011_07-sematech 

ALBANY, N.Y. / ST. FLORIAN, Austria, July 18, 2011 - SEMATECH, the global consortium of chipmakers and catalyst for accelerating the commercialization of technology innovations into manufacturing solutions, presented the consortium’s patterning strategy at the ISMI (International SEMATECH Manufacturing Initiative) 450 mm Industry Briefing during SEMICON West 2011.


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EV Group Highlights Technology Firsts, Key Advancements at SEMICON West 2011

thumbnail_headquarters  SEMICON WEST, San Francisco, July 12, 2011 - EV Group (EVG) today announced it will showcase a number of recent corporate and technology developments at SEMICON West 2011.  The company has seen an increase in order intake in fiscal 2011 of approximately 40 percent compared with fiscal 2010, and will break ground this month on an expansion that will more than double its manufacturing floor space. 

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EV Group Unveils Industry's First Wafer Bonding System for 450mm Silicon-On-Insulator Semiconductor Wafers

  Thumbnail_EVG850SOI450mm  SEMICON WEST, SAN FRANCISCO, Calif., July 11, 2011 - EV Group (EVG) today unveiled the semiconductor industry's first bonding system for 450-mm-diameter wafers manufactured from silicon-on-insulator (SOI) substrates. Building on EVG's leadership in SOI wafer bonding, the new system - dubbed the EVG850SOI/450mm - was created to support and facilitate the industry transition to 450mm wafers from the current 300mm standard.

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EV Group Joins Georgia Tech 3D Systems Packaging Research Center

thumbnail_IQAligner  ST. FLORIAN, Austria, July 6, 2011 - EV Group (EVG) today announced its engagement with the Georgia Institute of Technology 3D Systems Packaging Research Center (GT PRC) as a Manufacturing Infrastructure Member.  Through the consortia membership, EVG's state-of-the-art temporary bonding and debonding, chip-to-wafer bonding and lithography technology and associated product and process know-how will be included in the PRC's Silicon and Glass Interposer Industry (SiGI) Consortium research program.

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EV Group Gemini Wafer Bonder to be Implemented at Quebec's State-of-the-Art MiQro Innovation Collaborative Centre

thumbnail_Gemini200mm2  ST. FLORIAN, Austria, June 28, 2011 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order for its Gemini fully automated wafer-bonding system.  The Gemini system will be installed at the MiQro Innovation Collaborative Centre (C2MI), which is currently under construction in Technoparc Bromont (Quebec, Canada).

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EV Group Adds In-Line Metrology Capability to Wafer Bonding System to Support High-Volume 3D-IC and TSV Manufacturing

   thumbnail_EVG850DB  ST. FLORIAN, Austria, June 21, 2011 - EV Group (EVG) today announced it has introduced a new in-line metrology module for its EVG850TB automated temporary bonding and debonding systems.  This new metrology capability, which is now available as an option on the EVG850TB and EVG850DB platforms, allows customers to implement in-line process control for thin-wafer processing.

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IME Launches 11th Electronic Packaging Research Consortium

Singapore, 15 June 2011 - The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR) has launched its 11th Electronic Packaging Research Consortium (EPRC11) to address various technology challenges in advanced packaging technology in semiconductor in enabling smaller and smarter devices.
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Innovative SEMI High Tech U Program Introduces Greater Phoenix Area High School Students To World Of High Tech Careers - Sponsored By Fab Owners Association

PHOENIX, Ariz., June 1, 2011 -The SEMI Foundation presents the 119th High Tech U program in Phoenix, June 7-9, 2011 to support education and career awareness in the fields of high technology. During the three-day program, 36 students from Greater Phoenix area high schools will attend classes taught by volunteer industry professionals at the campuses of the EVG Group and ON Semiconductor.
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EV Group Teams with Industrial Technology Research Institute (ITRI) on Advanced MEMS Research and Development

ST. FLORIAN, Austria, June 1, 2011 -EV Group (EVG) today announced that it is collaborating with the Industrial Technology Research Institute (ITRI)-Taiwan's largest and one of the world's leading high-tech R&D institutions-in the development of advanced manufacturing processes for next-generation MEMS devices. As part of the collaboration, ITRI has purchased an EVG510 semi-automated wafer bonding system and an EVG6200 automated mask alignment system with top-bottom alignment and bond alignment options.
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EV Group Among the Top 10 Small Equipment Providers in Well Respected Industry Customer Satisfaction Survey

ST. FLORIAN, Austria, May 17, 2011 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, is pleased to announce that the company has, for the ninth consecutive year, received the distinction of being named one of the world’s top 10 small equipment providers in a well respected industry customer satisfaction survey.
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CEA-Leti to Implement Multiple EV Group Systems on its New 300-mm Fab Line Dedicated to 3D Integration

ST. FLORIAN, Austria, April 19, 2011 - EV Group (EVG) today announced that its longtime customer and partner, industry-leading research center CEA-Leti (Grenoble, France), has installed multiple EVG tools in its industry-first 300-mm cleanroom dedicated to R&D and prototyping for 3D-integration applications.  While Leti's new state-of-the-art facility is focused on R&D and prototyping, EVG's equipment will be leveraged with an eye toward widespread adoption of 3D technology for high-volume applications
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EV Group Recognized as Leader in Nanoimprint Lithography with Frost & Sullivan 2010 Technology Innovation Award

ST. FLORIAN, Austria, April 11, 2011 - EV Group (EVG)  today announced that it has received the 2010 European Nanoimprint Technology Product Innovation Award from independent market research firm, Frost & Sullivan.  The prestigious award recognizes EVG's accomplishments in addressing industrial needs with nanoimprinting solutions.
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EV Group Wins Compound Semiconductor Industry Award 2011

CS EUROPE, Frankfurt, Germany, March 29, 2011 – EV Group (EVG) today received the CS Industry Award for “EPIWAFER PROCESSING” for its EVG®850TB/DB Temporary Bonding/Debonding Systems. The inaugural Compound Semiconductor Industry Awards were presented at the CS Europe Conference in Frankfurt, Germany, which was attended by 150 industry professionals. The awards were established to recognise success and development along the entire value chain of the compound semiconductor industry from research to completed device, focusing on the people, processes and products that drive the industry forward.
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EV Group Advances SOI Leadership and Presence in China with First Order from SOI Supplier Shenyang Silicon Technology

SEMICON CHINA 2011, Shanghai, March 15, 2011 - EV Group (EVG) today announced that new customer Shenyang Silicon Technology Co., Ltd. (SST) has placed an order for an EVG850LT automated production bonding system for silicon-on-insulator (SOI) wafers.  The China-U.S. joint venture firm will utilize the EVG850LT, which was shipped in September 2010, in its state-of-the-art SOI production facility to expedite its efforts to ramp up high-volume manufacture of SOI wafers.
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Japan Earthquake and Tsunami: EVG Employees Safe, Business Operations Continue Uninterrupted

On behalf of all of us at EV Group, we are devastated to hear about the catastrophic damage that was caused by the Tohoku Pacific earthquake and tsunami. At the same time, we are humbled to witness the remarkable strength and courage by the people in Japan and are committed to supporting the recovery and rebuilding efforts.
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应对快速增长的HB-LED市场需求,EVG推出EVG620HBL光刻系统

2011 3 8 中国国际半导体设备与材料展览会暨研讨会 —— 今天 世界领先的先进半导体与封装 微机电系统 硅绝缘体 SOI 新兴 纳米技术市场 晶圆键合 与光刻设备应供应商 EVG 宣布 其产品组合中再添新成员 这一 全新的 EVG620HBL 全自动光刻系统以经过实战作业验证的 EVG 光刻机平台为基础 旨在优化 高亮度发光二极管 HB - LED 、复合半导体和动力电子设备的生产制造
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