新闻档案 2010

Shrink Nanotechnologies’ Shrink Chips Cell Culturing Unit Enters into Exclusive Development and Manufacturing Agreement with EV Group to Commercialize the StemDisc Platform

CARLSBAD, Calif., Dec. 8, 2010 - Shrink Nanotechnology announced today that it has entered into a multi-year development and manufacturing agreement with EV Group, a leader in the nano-imprint lithography process development and equipment manufacturing. The mutually exclusive, two year agreement calls for EV Group and Shrink to develop and manufacture Shrink’s structured substrates for its StemDisc stem cell and cell culturing platform.
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New Wafer-Level Microlens Molding Process from EVG Extends Manufacturing Roadmap for CMOS Image Sensors

SEMICON JAPAN, Chiba, Japan, December 1, 2010 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has developed a new micro-lens molding process that can enable volume production of very-high-resolution (up to eight megapixels and higher) wafer-level optics for use in smart phones, pico projectors and myriad other applications.
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EV Group Realizes Continued Growth for Fiscal Year 2010 on Top of an Already Successful Prior Year

ST. FLORIAN, Austria, November 2, 2010 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the company witnessed a more than 20-percent increase in overall revenue during fiscal 2010, ended September 30.
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EV Group Wins Order for UV-NIL/Hot Embossing Systems from Fraunhofer Research Institution for Electronic Nano Systems

SEMICON EUROPA, Dresden, Germany, October 19, 2010 - EV Group (EVG) today announced receipt of its first order from the Fraunhofer Research Institution for Electronic Nano Systems ENAS (Chemnitz, Germany).  Fraunhofer ENAS purchased an EVG6200NT automated mask aligner and an EVG540 automated wafer bonder, and will employ the flexible, multi-process EVG systems for mask lithography, ultraviolet nanoimprint lithography (UV-NIL), bond alignment, bonding and hot embossing (HE). 
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EVG Unveils EVG520L3 Next-Generation Wafer Bonding System with Key Cost-of-Ownership Advantages for Advanced Packaging and MEMS Applications

SEMICON EUROPA, Dresden, Germany, October 19, 2010 - EV Group (EVG) today announced the latest addition to its industry-leading EVG500 Series of permanent wafer bonding systems.  The new three-chamber EVG520L3 wafer bonding system builds on the series' proven strengths in temperature control, piston force uniformity and modularity, with the next major implementation of the bond chamber concept-addressing the need for high-vacuum, CMOS-compatible bonding processes while delivering significantly higher throughput, cost of ownership (CoO) and yields.
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EV Group' s Gemini Wafer Bonder Selected by MEMS Pioneer Sensonor for High-Volume Production of Thermal Imaging Devices

SEMICON EUROPA, Dresden, Germany, October 18, 2010 - EV Group (EVG)  today announced it has received an order for its GEMINI® fully automated wafer bonding system from Sensonor Technologies AS-a pioneer in the manufacture of MEMS sensors. 
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EV Group Breaks through Resolution Barrier with Introduction of Soft UV Nanoimprint Lithography Technology

NNT CONFERENCE, Copenhagen, Denmark, October 13, 2010 - EV Group (EVG)  today unveiled a new technology capability that enables ultra-high resolution patterning of features down to 12.5 nm: Soft Molecular Scale Nanoimprint Lithography (SMS-NIL). Based on EVG's proven UV-NIL systems, SMS-NIL provides customers with a repeatable, cost-effective process for producing ultra-high-resolution patterning on large-area surfaces.
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EV Group Installs its Wafer Cleaning System for Compound Semiconductor Research at the University of Tokyo

TOKYO, JAPAN, September 29, 2010 – EV Group (EVG) today announced it has received an order from the University of Tokyo for its EVG301 megasonic wafer cleaning system for compound semiconductor research.  Installed at the university’s Takagi & Takenaka Laboratory, the new tool is focused on preparing a particle-free wafer surface for bonding III-V materials to silicon wafers. 
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EV Group Strengthens Presence in Middle East with Order Win from King Abdullah University of Science and Technology

ST. FLORIAN, Austria, September 23, 2010 – EV Group (EVG) today announced it has shipped an EVG520IS semi-automated wafer bonding system and two EVG6200 automated alignment systems to King Abdullah University of Science and Technology (KAUST) in Saudi Arabia. Students at the graduate-level institution will use the EVG equipment for advanced technology research and development, including projects outsourced to KAUST from technology firms in the region.
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EV Group Shows Responsibility for Environmental Impact

ST.FLORIAN, 14 September 2010 – EV Group (EVG), a technology and market leader for wafer processing equipment, was recently awarded ISO 14001 certification.  This award certifies that the Austria-based company exhibits an effective environmental management system and is committed to pursuing further environmental activities.
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EV Group Capitalizes on MEMS Market Leadership, Further Diversifies Business with Key 3D IC and LED Manufacturing Technology Advances

SEMICON WEST, San Francisco, July 13, 2010 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order for its EVG520IS semi-automated wafer bonding system and EVG620TB mask and bond aligner from the University of Texas at Arlington (UTA).
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EV Group Introduces Industry's First Fully Automated Wafer Bonding System for High-Brightness LED Manufacturing

ST. FLORIAN, Austria, July 12, 2010 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has introduced the EVG560HBL wafer bonder-the industry's first fully automated wafer bonding system for high-brightness light emitting diode (HB-LED) manufacturing. 
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EV Group and the Institute of Microelectronics in Singapore Partner to Advance Through-Silicon Via Process Development for 3D IC Integration

St. Florian, AUSTRIA and SINGAPORE, July 8, 2010– EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and the Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), today announced that they have entered into a two-year cooperation agreement to advance 3D IC integration technologies.
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EV Group Introduces New EVG610 Mask and Bond Aligner Optimized for Greater Cost and Process Flexibility

ST. FLORIAN, AUSTRIA, July 6, 2010 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has introduced the EVG610 mask and bond aligner, specifically to address its university and research customers' demands for a lower costing system with greater process versatility. 
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Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Developing Processes for High-Volume Manufacturing of 3D ICS

ST. FLORIAN, Austria, May 31, 2010 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that world-renowned research institute, Fraunhofer IZM-ASSID, has placed an order for two EVG temporary bonding and debonding (TB/DB) systems for thin-wafer handling and processing for 3D ICs.
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Wafer-Level Camera Manufacturer, Nemotek Technologie, selects EV Group Wafer Bonding and UV Nanoimprint Lithography Systems for Capacity Ramp

ST. FLORIAN, AUSTRIA, March 30, 2010 - EV Group (EVG) today announced that Morocco-based wafer-level camera manufacturer Nemotek Technologie has placed a repeat order for EVG’s bonding and UV nanoimprint lithography (UV-NIL) systems – the EVG520IS and IQ Aligner.
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University of Michigan's Lurie Nanofabrication Facility selects EV Group Wafer Bonding Systems for advanced MEMS research

ST. FLORIAN, AUSTRIA, March 2, 2010 - EV Group (EVG) today announced that it has shipped two wafer bonding systems to the University of Michigan's Lurie Nanofabrication Facility (LNF) - a leading center for MEMS and microsystems research and an integral member of the National Nanotechnology Infrastructure Network (NNIN), which is supported by the National Science Foundation.
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NILCOM consortium to highlight latest developments at nano tech 2010

NANO TECH 2010-TOKYO, JAPAN, February 9, 2010 - NILCom, a nanoimprint lithography consortium comprising companies and research organizations throughout the imprint lithography supply chain, will be exhibiting at nano tech 2010 held February 17-19 in Tokyo, Japan.
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