新闻档案 2009

SEMEFAB broadens diverse process portfolio with the installation of an EVG520IS Wafer Bonding System

GLENROTHES, SCOTLAND, UK, November 5, 2009 - Semefab (Scotland) Ltd, a leading, independent wafer fab foundry, today announced that it will further broaden its diverse process portfolio with the installation of a wafer bonding system from EV Group.
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EV Group installs fusion Wafer Bonding Systems at two leading CMOS image sensor manufacturing facilities in Asia

SEMICON Europa 2009, October 6, 2009 – EV Group (EVG) today announced that it has completed the installation of two automated fusion bonding systems for 300-mm wafers at a leading semiconductor foundry and at a major consumer electronics manufacturer.
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EV Group´s GEMINI® Wafer Bonder selected by leading Korean Research Center and foundry service provider RFID/USN for 3D MEMS Manufacturing

September 29, 2009 - EV Group (EVG) today announced that the RFID/USN Center (Incheon, Korea) has selected EVG's fully automated GEMINI® wafer bonding system for stacked 3D MEMS device development
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EV Group hosts its first EVG Technology Day in Turkey to support the region's growing R&D efforts in Advanced MEMS, NEMS and Semiconductors

September 17, 2009 - EV Group (EVG) today announced that it will host an EVG Technology Day on October 2, 2009 at the Bilkent Hotel in Ankara, Turkey.
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EV Group to collaborate with Applied Materials on thin wafer bonding technology for 3D IC development

ST. FLORIAN, AUSTRIA, July 16, 2009 - EV Group (EVG) today announced a joint effort with Applied Materials, Inc. to develop wafer bonding processes for the manufacture of through-silicon vias (TSVs)
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EV Group witnesses rise in order intake and increase in demand for services

SEMICON WEST, San Francisco, Calif. July 14, 2009 - EV Group (EVG), today announced it is witnessing continued momentum during its fiscal year 2009 as the company moves through its third quarter, ending June 30. 
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EV Group unveils next-generation UV-nanoimprint lithography (UV-NIL) step and repeat system - the EVG770 Gen II NILStepper

ST. FLORIAN, AUSTRIA, July 13, 2009 - EV Group (EVG), today unveiled its next-generation UV-nanoimprint lithography (UV-NIL) step and repeat system-the EVG770 Gen II NIL Stepper. 
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EV Group secures order for 300 mm wafer bonder from Sematech's 3D interconnect program at Ualbany Nanocollege

ALBANY, NEW YORK and ST. FLORIAN, AUSTRIA, July 9, 2009 - EV Group (EVG), today announced that SEMATECH, the global consortium of chipmakers, has selected EVG's fully automated 300-mm GEMINI® wafer bonder for enabling next-generation TSV and 3D interconnects.   
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IME launches 10th Electronic Packaging Research Consortium to address 3-dimensional integrated circuits

Singapore, 30 June 2009 - The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), today announced the launch of the 10th Electronic Packaging Research Consortium (EPRC-10) to address key integration challenges of 3-dimensional (3-D) Packaging and Embedded Module technologies during a signing ceremony.
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EV Group completes wafer bonding portfolio with the launch of its new generation EVG501 R&D system

June 9, 2009 - EV Group (EVG) today announced that it has launched an all-new EVG501 wafer bonder system to address rising cost burdens for its university and R&D customers.
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MCA Public Relations to host BrightspotsForum on 3D IC Technology

MOUNTAIN VIEW, Calif., June 8, 2009—MCA, a global, high-tech public relations agency, today announced it will be hosting an online panel discussion in cooperation with SemiNeedle, dubbed the BrightSpots 3D IC Forum, which will enable industry professionals to partake in an active discussion exploring the key issues surrounding 3D ICs from design to manufacture.
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EV Group secures order win from leading RF components manufacturer EPCOS

June 4, 2009 - EV Group (EVG) today announced that EPCOS – a leading electronic components, modules and systems manufacturer – selected EVG’s fully automated GEMINI wafer bonder for high-volume RF components production at EPCOS’s production facility based in Munich, Germany.
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EVG named among Top 5 in VLSI Research's The Best Chip Making Equipment Suppliers by Segment

May 20, 2009 – EV Group (EVG), is pleased to announce that the company has received the distinction of being named one of the world’s top 10 small suppliers of wafer processing equipment for the seventh consecutive year by VLSI Research, Inc.
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Fraunhofer IOF selects EV Group UV-Nanoimprint Lithography (UV-NIL) System for Leading-Edge applied Optoelectronics R&D

May 12, 2009 - EV Group (EVG) today announced that Fraunhofer Institute for Applied Optics and Precision Engineering IOF oriented research-selected EVG's UV-based nanoimprint lithography (UV-NIL) step and repeat system for its leading-edge optoelectronic research efforts.
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EV Group gains Amberwave Systems as a new customer for bonding and plasma activation solutions

April 29, 2009 - EV Group (EVG) today announced it has received an order from AmberWave Systems for its EVG520IS wafer bonding system and its EVG810LT low-temperature plasma activation system.
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EV Group realizes strong first half year in fiscal 2009

April 22, 2009 - EV Group (EVG) today announced that the company will increase its production capacity in light of strong order intake in its first half year of fiscal 2009. 
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EV Group and CEA/Leti Partner to accelerate adoption of TSV and 3D Integration Technology

April 1, 2009 - EV Group (EVG) today announced it has entered a joint development program (JDP) with CEA/Leti-one of Europe's renowned research labs focusing on microelectronics and nanotechnology. 
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EV Group receives order for photoresist developer from the University of Tokyo

March 17, 2009 - EV Group (EVG) today announced that they have received an order for its EVG101D, a photoresist developer, from the University of Tokyo.
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Applied Materials joins EMC-3D equipment and materials consortium

February 24, 2009 - The international EMC-3D semiconductor equipment and materials consortium today announced that Applied Materials, Inc. (Nasdaq: AMAT) has joined the organization.
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EV Group receives significant follow-on order from leading pure-play MEMS foundry Silex Microsystems

February 3, 2009 - EV Group (EVG) today announced that Sweden-based Silex Microsystems, the world's largest independent MEMS foundry, has placed a major follow-on order for its GEMINI automated bond cluster, EVG 6200NT mask and bond aligner and EVG301 mask cleaner.
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EV Group demonstrates continued MEMS leadership around the globe with order win from Samsung Electro-Mechanics

January 20, 2009 - EV Group (EVG) today announced that leading Korean components manufacturer, Samsung Electro-Mechanics Co., LTD. (SEMCO), selected the company’s EVG810LT, a LowTemp® plasma activation system, for its R&D work involving stacked and 3D MEMS devices.
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EV Group and Brewer Science establish Ultra-Thin Wafer Bonding Lab in Taiwan

January 7, 2009 - EV Group (EVG) and Brewer Science, Inc., today announced the installation of an EVG 500 series wafer-bonding system at Brewer Science's Taiwan applications lab.
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