ST. FLORIAN, AUSTRIA, April 1, 2009 - EV Group (EVG), a
leading supplier of wafer bonding and lithography equipment for the MEMS,
nanotechnology and semiconductor markets, today announced it has entered a
joint development program (JDP) with CEA/Leti-one of Europe's renowned
research labs focusing on microelectronics and nanotechnology. EVG,
an early leader in through-silicon-via (TSV) and 3D integration technology,
will provide CEA/Leti with its world-class, 300-mm temporary bonding and
debonding technology. The first system will be shipped in May.
The joint development work will focus on further developing these
technologies and processes to accelerate continued adoption of TSV
technology-given its demonstrated advantages, which include higher
performance, increased functionality, smaller footprint and lower power
consumption.
More functionality, lower power
Flash memory and image sensors continue to lead the charge implementing 3D
IC/TSV technology due to the complexity of the device structure and demands
for more functionality with lower power. In demonstrating a
cost-effective, manufacturable stackable interconnection technology,
experts project TSV adoption to grow intensively over the next few years
expanding into various other advanced IC applications. This joint
development program spearheads another critical step to readying integrated
device manufacturers and foundries to fully implement 3D integration
technology and processes into their production lines, and bringing this
technology's advantages to a global commercial scale.
"We are extremely pleased to be working with EVG-not only for their proven
bonding/debonding and thin-wafer handling technology systems, but also for
the tremendous groundwork and expertise on tools for TSV technology and 3D
integration they bring to the table, which complements our own know-how in
this field," said Nicolas Sillon, the head of the laboratory for advanced
packaging and 3D integration at Leti. "TSV and 3D integration is
proving to be a viable solution to a critical roadblock in advanced device
performance. Together we can continue to unlock the full potential of
this technology to ensure widespread commercialization for high-volume
applications."
Successful results
Commenting on today's announcement, Stefan Pargfrieder, EVG's business
development manager noted, "CEA/Leti is a world leader in accelerating
emerging technologies to widespread market adoption. We are thrilled
to be working with such a prestigious institution, and believe their
expertise will be crucial to this JDP and pushing TSV and 3D technology
forward in the market place. We are seeing an increasing number of
high-volume manufacturers exploring implementation of this technology in
their production lines, and this joint effort with CEA/Leti will be
instrumental in continuing this positive momentum."
This cooperation also strengthens the existing and established joint
development activities between Brewer Science, EVG and Leti.
Ultimately, it exemplifies the synergy between materials, equipment and
process expertise, and further enables value-added products and know-how in
the growing field of 3D IC/TSV technology, as well as other potential users
of temporary bonding and debonding techniques.
CEA/Leti and EV Group have already commenced work on the project and have
produced successful results in 3D applications using their TSV technology
and processes.
About EV Group
EV Group (EVG) is a world leader in
wafer-processing solutions for semiconductor, MEMS and nanotechnology
applications. Through close collaboration with its global customers,
the company implements its flexible manufacturing model to develop
reliable, high-quality, low-cost-of-ownership systems that are easily
integrated into customers' fab lines. Key products include wafer
bonding, lithography/nanoimprint lithography (NIL) and metrology equipment,
as well as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG
holds a leading position in NIL and lithography for advanced packaging and
MEMS. Along these lines, the company co-founded the EMC-3D consortium
in 2006 to create and help drive implementation of a cost-effective
through-silicon via (TSV) process for major ICs and MEMS/sensors.
Other target semiconductor-related markets include silicon-on-insulator
(SOI), compound semiconductor and silicon-based power-device
solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates
via a global customer support network, with subsidiaries in Tempe, Ariz.;
Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li,
Taiwan. The company's unique Triple i-approach (invent - innovate -
implement) is supported by a vertical integration, allowing EVG to respond
quickly to new technology developments, apply the technology to
manufacturing challenges and expedite device manufacturing in high
volume. More information is available at www.EVGroup.com.
About CEA-LETI
CEA-LETI, the Laboratory for Electronics & Information Technology is
operated by Direction de la Recherche Technologique at CEA, the French
Atomic Energy Commission. It mainly aims at helping companies to
increase their competitiveness through technological innovation and
transfer of its technical know-how to industry. Major player in the
MINATEC Micro-Nano technologies innovation center, CEA-LETI benefits from
8000 m2 state-of-the-art clean rooms, with equipments worth some 160
million euros. It is currently employing some 1600 people among whom
1100 CEA employees and co-workers of various status including 100 people
from industrial partners, working in the CEA-LETI premises within the
framework of bilateral collaborations. Overall, research contracts
with industry are worth 75% of CEA-LETI annual income. It has a very
important patents portfolio, and filed last year more than 200 patents and
700 publications. The laboratory is structured into six departments,
with a specific department operating 24-7 the technological facilities of
the silicon technology platform, and five application-oriented programs
covering the fields of microelectronics, microsystems, optronics, system
design and telco, and technologies for bio and healthcare. For more
information, visit www.leti.fr.
Press Contact
EV Group
Clemens Schütte, Director, Marketing and Communications
Tel: +43 7712 5311 0
E-mail: Marketing@EVGroup.com
Karen Do, Account Manager, MCA, Inc.
Tel: +1-650-968-8900, ext. 108
E-mail: kdo@mcapr.com
CEA-LETI
Clément Moulet, Press Officer
Tel: +334.38.78.03.26
E-mail : clement.moulet@cea.fr