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EV Group Scores Fourth Consecutive Triple Crown Win in Annual VLSIresearch Customer Satisfaction Survey  

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ST. FLORIAN, Austria, June 21, 2016 - EV Group (EVG) today announced that, for the fourth successive year, it has earned all three awards resulting from VLSIresearch Inc.'s annual Customer Satisfaction Survey. For 2016, EVG was ranked as one of the 10 BEST Focused Chip Making Equipment Suppliers, having steadily increased its overall ratings since 2013. EVG was also cited as one of THE BEST Suppliers of Fab Equipment and received a RANKED 1st award in Specialty Fab Equipment.


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EV Group Receives Multiple Orders for GEMINI® FB XT Fusion Bonder for 3D Chip Stacking Production Applications  

Fusion_Bonding_Leadership_2ST. FLORIAN, Austria, May 10, 2016 - EV Group (EVG) today announced that it has received multiple orders for its GEMINI® FB XT automated fusion wafer bonders from multiple leading device manufacturers.These latest orders will support several leading-edge HVM applications, including 3D stacked image sensors, memory stacking, and die partitioning for next-generation 3D system-on-chip (SoC) devices.

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EV Group Receives Prestigious Supplier Excellence Award from Analog Devices  

ADI_Award_1_thumbnailHONG KONG / ST. FLORIAN, Austria, April 5, 2016 - EV Group (EVG) has received a 2015 Supplier Excellence Award from Analog Devices Inc. (ADI) in the category of "Special Achievement". This prestigious award is presented annually to outstanding suppliers that play a key role in ADI's success and that work with ADI in the ongoing development and improvement of products and manufacturing processes.

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EV集团(EVG)为显示器制造提高纳米压印技术  

EVG7200_LA_cleanroom_thumbnail EV 集团 (EVG) 作为微电子机械系统、纳米技术和半导体市场的晶圆键合和光刻设备的供应商主导, 近日在奥地利圣弗洛里安宣布推出 EVG ® 7200 LASmartNIL 系统,用于需要大面积基板的显示器制造及其他应用。该自动化 UV 纳米压印技术 (UV-NIL) 系统利用了 EVG 专有的 SmartNIL 技术,可以在大批量制造应用上实现具有成本效益的纳米图案化。

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JOANNEUM RESEARCH and EV Group Jointly Develop Large-Area Nanoimprint Lithography Solution for Microfluidics and Photonics Applications  

EVG_JOANNEUM_Thumbnail ST. FLORIAN / GRAZ, Austria, March 10, 2016 - EV Group (EVG), and JOANNEUM RESEARCH (JR) today announced that they are collaborating on a joint-solution for research and development activities in large-area nanoimprinting leveraging the EVG®770 automated UV-nanoimprint lithography (NIL) step-and-repeat system. Specifically, the two organizations have adapted the EVG770 with new capabilities to accommodate foil substrates that will enable the EVG770 to be used at JR to manufacture flexible master templates applied in roll-to-roll NIL processing for photonics, functional surfaces and microfluidic device production.

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2015 European SEMI Award Honors Paul Lindner  

SEMI_Europe_Award_thumbnailNICE, France - 8 March 2016 - Paul Lindner, executive technology director at EV Group, is the recipient of the 2015 European SEMI Award.  Since 1989, the European SEMI Award has been presented to the person or team that made significant contributions to the European semiconductor and related industries. This award, an industry honor for Lindner, was presented at the SEMI Industry Strategy Symposium Europe 2016 conference held in Nice on 6–8 March.

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EV集团将GEMINI® 300毫米自动化生产晶圆键合系统带入微电子机械系统制造业

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2016 3 7 EV 集团( EVG )在奥地利圣弗洛里安宣布其 EVG GEMINI ® 300 毫米自动化生产晶圆键合系统即将应用于未来微电子机械系统大批量制造( HVM 这是微电子机械系统工业的重要里程碑 。到 目前为止较小的 200 毫米晶圆基片已用于微电子机械系统大批量制造。 EV 集团 ( EVG) 是微电子机械系统、纳米技术及半导体市场中一家领先的晶圆键合及光刻设备供应商,。


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WIKA Group Adopts HERCULES® Lithography Track System From EV GROUP for Pressure Sensor Manufacturing  

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ST. FLORIAN, Austria, February 17, 2016 - EV Group (EVG) today announced that WIKA Group, a global leader in pressure, temperature and level measurement technology, has put an EVG HERCULES® lithography track system into production for manufacturing pressure sensor devices. The HERCULES system has shortly been installed and is in operation at WIKA's fabrication headquarters in Klingenberg, Germany.


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EV Group Joins IRT Nanoelec 3D Integration Program  

2016_02_IRT3D_TeaserST. FLORIAN, Austria, February 5, 2016 -  EV Group (EVG) today announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. EVG joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D wafer-to-wafer bonding technologies. SET also joined recently the consortium.

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Korean National Nanofab Center Installs High-Vacuum Wafer Bonder from EV Group for Advanced MEMS Research and Foundry Services  

Thumbnail_EVG520IS_NNFCST. FLORIAN, Austria, January 26, 2016 - EV Group (EVG) today announced that it has supplied an EVG520IS semi-automated wafer bonding system with high-vacuum capability to the National Nanofab Center (NNFC), based in Daejeon, Korea. The vacuum capability of the EVG system (up to 5x10-6 mbar) makes it ideally suited for MEMS applications that require a high-vacuum environment be maintained in the cavity after bonding, such as gyroscopes and micro-bolometers.

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