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EV Group Launches Second-Generation EVG620HBL Mask Alignment System for LED Manufacturing

STRATEGIES IN LIGHT, Santa Clara, Calif., February 7, 2012 – EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, compound semiconductors, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the EVG620HBL Gen II—the second generation fully automated mask alignment system for volume manufacturing of high-brightness light-emitting diodes (HB-LEDs).

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EV Group Signs Collaboration Agreement with Eulitha to Establish Low-Cost-of-Ownership Nanopatterning Solutions for HB-LED Manufacturing

ST. FLORIAN, Austria, January 10, 2012 - EV Group (EVG) today announced that it has signed a joint-development and licensing agreement with Eulitha AG, a pioneer and leader in the production of high-quality nanostructures using advanced lithography techniques. EVG will integrate Eulitha's PHABLE™ mask-based ultraviolet (UV) photolithography technology with EVG's automated mask aligner product platform.

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Asahi Kasei Orders IQ Aligner UV-NIL System from EV Group for Advanced Materials Development for High-Resolution Wafer-Level Optics

SEMICON JAPAN, CHIBA CITY, Japan, December 6, 2011 - EV Group (EVG) today announced that Asahi Kasei E-Materials Corporation, the core operating company of the Asahi Kasei Group for electronics materials, energy materials, photosensitive materials and epoxy resins, has purchased an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EVG.

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EV Group Boosts High-Volume Manufacturing Performance across Product Lines with New XT Frame Equipment Platform

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ST. FLORIAN, Austria, December 6, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has introduced a new equipment platform, dubbed the XT Frame, that extends process throughput and tool functionality for virtually all of its current volume-manufacturing product offerings.

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上海新傲科技公司继续订购EVG晶圆片键合机，迈入先进的全自动SOI晶圆生产模式

2011 年 11 月 9 日，奥地利圣弗洛里安市讯 —— 今天，世界领先的微机电系统、纳米技术和半导体市场晶圆键合与光刻设备供应商 EVG 宣布，中国领先的晶圆制造商之一上海新傲科技有限公司（以下简称 “ 新傲 ” ）向其下达了一份用于硅绝缘体（ SOI ）和晶片直接键合的 EVG850 自动化生产键合系统后续订单

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EV Group Launches ZoneBOND™ Capable Equipment and Open Platform for Temporary Bonding Materials

ST. FLORIAN, Austria, October 26, 2011- EV Group (EVG) today announced that it has launched a suite of groundbreaking temporary bonding and debonding (TB/DB) equipment modules that support ZoneBOND™ technology. In parallel, EVG has opened its TB/DB equipment platform to enable the use of a wide range of adhesives from various suppliers to give customers the most flexible choice of bonding materials.

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Brewer Science and EV Group Announce Agreement on ZoneBOND™ Technology

ROLLA, MO, USA and ST. FLORIAN, AUSTRIA, October 20, 2011 - Brewer Science, Inc., a global leading innovator and manufacturer of specialty materials, process solutions, and equipment for the microelectronics industry, and EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today announced an agreement on ZoneBOND™ technology.

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EV Group and Fraunhofer IZM-ASSID Establish Joint Development Agreement for High-Volume 3D Integration Applications

SEMICON EUROPA, Dresden, Germany, October 11, 2011-EV Group (EVG) today announced that it has established an agreement with world-renowned research institute Fraunhofer IZM-ASSID to jointly develop high-volume manufacturing processes for 3D IC integration applications.

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