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EV Group Receives 3D InCites Award for GEMINI FB XT Automated Fusion Wafer Bonder

 

2015_07_3DIC_Logo ST. FLORIAN, Austria, July 30, 2015-EV Group (EVG) today announced that it has received a 2015 3D InCites award for its GEMINI®FB XT automated fusion wafer bonder in the category of 3D manufacturing equipment. Hosted by 3D InCites, an online media resource founded in 2009 to stir up interest in 3D IC integration and 3D packaging technologies, the 3D InCites Awards program recognizes achievements to further the commercialization of 3D integration technologies.

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Leti and EVG Launch INSPIRE, a Lithography Program Aimed At Demonstrating Benefits of Nano-imprint Technology

 

2015_07_INSPIRE_Thumbnail GRENOBLE, France, and ST. FLORIAN AM INN, Austria - July 15, 2015 - CEA-Leti and EV Group have launched a new program in nano-imprint lithography (NIL) called INSPIRE to demonstrate the benefits of the versatile, powerful nano-patterning technology and spread its use for applications beyond semiconductors.

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EV Group Achieves Third Consecutive Triple Crown Win in 2015 VLSIresearch Customer Satisfaction Survey

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ST. FLORIAN, AUSTRIA, July 14, 2015 - EV Group (EVG) announced that for a third year in a row, it has earned all three coveted awards from VLSIresearch's annual customer satisfaction survey. EVG has again been ranked as one of the 10 BEST Focused Chip Making Equipment Suppliers, as well as one of the 2015 THE BEST Suppliers of Fab Equipment. Additionally, EVG was distinguished with a 2015 RANKED 1st award in the Other Fab Equipment category. 


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EV Group Ramps Nanoimprint Lithography into High-Volume Manufacturing with HERCULES® NIL Track System

2015_07_HERCULES_NIL_Thumbnail ST. FLORIAN, Austria, July 7, 2015-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the HERCULES® NIL-a fully integrated track system that combines cleaning, resist coating and baking pre-processing steps with EVG's proprietary SmartNIL™ large-area nanoimprint lithography (NIL) process in a single platform.

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EV Group NILPhotonics™ Competence Center Sees Strong Customer Demand for Emerging Photonic Applications

201505_NILPhotonics_milestone 120px ST. FLORIAN, Austria, May 19, 2015-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that its NILPhotonics™ Competence Center-established to assist customers in enabling new and enhanced products and applications in the field of photonics-has generated strong interest from customers and resulted in multiple system orders since its launch in December 2014.

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EVG延续在高真空晶片键合工艺技术上的领导地位

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EVG 集团是一家为微电子机械系统、纳米技术以及半导体市场提供晶片键合以及光刻技术设备的全球领先供应商。 2015 3 16 日在奥地利的圣弗洛里安, EVG 集团现为全自动高真空共晶键合设备的 EVG ®580 ComBond ® 系列推出了两款新的配置。根据大学、研究所和批量生产商的不同需求,这两款配置能够在室温下实现不同晶格常数和不同热膨胀系数的材料导电的无氧化键合。


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EV Group Establishes Nanoimprint Lithography Competence Center for Photonic Applications

201412EVG-SmartNIL ST. FLORIAN, Austria, December 01, 2014-EV Group (EVG) today announced that it has established the NILPhotonics™ Competence Center, which is designed to assist customers in leveraging EVG's suite of nanoimprint lithography (NIL) solutions to enable new and enhanced products and applications in the field of photonics.

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