EVG|Download: Press Releases and Photos

EVG Headquarters

EV GROUP HIGHLIGHTS TECHNOLOGY FIRSTS, KEY ADVANCEMENTS AT SEMICON WEST 2011
Recent Developments Span 450mm Wafer Bonding, In-Line Metrology, Growth in Target Markets, Headquarters Expansion,
and Industry and University Collaborative R&D Efforts

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EVG850DB Automated Debonding System

EV GROUP ADDS IN-LINE METROLOGY CAPABILITY TO WAFER BONDING SYSTEMS TO SUPPORT HIGH-VOLUME 3D-IC AND TSV MANUFACTURING
First-ever Integration of In-line Metrology with Temporary Bonding/Debonding Enables More Repeatable and Reliable Process, Improved Yields and Lower Cost of Production

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GEMINI Automated Production Wafer Bonding System

EV GROUP GEMINI WAFER BONDER TO BE IMPLEMENTED AT QUEBECS´S STATE-OF-THE-ART MIQRO INNOVATION COLLABORATIVE CENTRE
EVG System to Play Vital Role in Enabling Joint-Partnership R&D Facility's Focus on MEMS and Wafer-Level Packaging and Integration Solutions

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Topside Mask Alignment

EV GROUP JOINS GEORGIA TECH 3D SYSTEMS PACKAGING RESEARCH CENTER
EVG’s State-of-the-Art Wafer Bonding and Lithography Equipment and Know-How to Be Leveraged in Silicon and Glass Interposer Research Program

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