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SmartView Wafer-to-Wafer Bond Aligner
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Requirements

Together with our suppliers we want to reach an optimum of quality and efficiency.

To be able to reach this mentioned optimum, we are expecting from our strategic suppliers the entire fulfillment of the following criteria:

  • High potential of development
  • Leadership in know-how
  • Leadership in costs
  • Leadership in performance
  • Own manufacturing of mechanical parts
  • Readiness for investments and liquidity
  • Logistic binding to EVG
  • Readiness for collective value- and cost analysis
  • Flexibility and reliability

Also the position as a "Global Player" would be of advantage, one who serves our headquarters as well as our world-wide subsidiaries.

   SEE ALSO:

NanoAlign Technology


LowTemp Plasma Bonding


Advanced-chip-to-wafer Technology (AC2W)


VLSI 10BEST 2006

 
   
   
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