Press Release
EV Group develops first mask aligner with LED light source 2006-07-11 EV Group (EVG), the leading supplier of wafer-bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced the availability of the industry first LED (Light Emitting Diode) light source for mask aligner systems. This LED light source is now available for all EVG mask aligner systems and outperforms conventional UV light sources by offering reduced cost of ownership, reduced maintenance and superior exposure results. Equipping mask aligners with a LED light source provides unique advantages in process safety and environmental issues. EHS (Environmental, Health and Safety) risks involved with use of high pressure mercury arc lamps are eliminated with the new LED technology.
“Applying LED technology in our mask aligners, we can offer an advanced exposure source and support our high volume manufactures with low cost of ownership and reduced maintenance. The operation cost savings compared to conventional Hg lamp operated mask aligners are typically greater than 50% - both for HVM and R&D users.”, says Erich Thallner CEO and founder of EV Group. Regular maintenance tasks such as replacement of UV lamps will be a thing of the past. Especially in high-volume production, every single cost factor is critical. Compared to UV light sources, the LED light source enables low power operation and therefore eliminates costs for Nitrogen cooling. The LED light source represents a breakthrough in lowest cost of ownership by offering a maintenance-free lifetime of more than 10 years under common-practice operation and production conditions. It proves again EVG’s position in being ahead of setting new industry standards for wafer processing. Further information of New Dimensions in E-Trading will be available at EVG’s booth at SEMICON West 2006, booth no. 5426 North Hall. About EV Group
Founded in 1980, EV Group is a global supplier of wafer bonders, aligners, photoresist coaters, cleaners and inspection systems for semiconductor, MEMS and emerging nanotechnology markets. EV Group holds the dominant share of the market for wafer bonding equipment and is a leader in lithography for advanced packaging, MEMS and Nanoimprint Lithography (NIL). The company's unique Triple I approach (Invent - Innovate - Implement) is supported by a vertical infrastructure, allowing EV Group to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. Headquartered in St. Florian, Austria, EV Group operates via a global customer support network, with subsidiaries in Tempe, Arizona; Albany, New York; Yokohama and Fukuoka, Japan; and Chung-Li, Taiwan. For more information, visit www.EVGroup.com. Contact
Paul Lindner
EV Group
DI Erich Thallner Strasse 1
4782 St. Florian/Inn
Phone.: + 43 7712 5311 – 5200
Fax.: + 43 7712 5311 – 4600
P.Lindner@evgroup.com |
