SAW소자

Surface acoustic wave (SAW) devices are electronic devices used in telecommunications products. Billions of these extremely versatile devices are manufactured every year, and the potential is growing further as they find applications in many new, emerging fields ranging from industrial to commercial.

소개 웨이퍼수준본딩

SAW devices are fabricated by photolithography, metallization and bonding processes to form and package the metal structures on the piezoelectric substrate material surface. In order to keep the expansion of those piezoelectric materials as small as possible, they need to be bonded to materials which have small coefficients of thermal expansion such as quartz or Silicon. Wafer bonding is used to encapsulate SAW devices through wafer level packaging processes at the end of the line.

Please see our related products under the section Wafer Bonding Systems for further information.

Resonators. Courtesy of EPCOS AG.

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