The EVG6200NT Automated Mask Alignment System, which handles sizes of substrates starting from 3 inches up to 200 mm, offers new state-of-the-art features, including a granite base, active vibration isolation and linear motors to meet higher precision and throughput requirements. Built upon EV Group´s most flexible and versatile alignment system platforms, these new systems enable manufacturers to easily scale between R&D efforts to volume manufacturing in a simple one-to-one process transfer from manual mode to full automation. The ramp-up ease to volume manufacturing coupled with alignment accuracies improvements-down to 0.1 µm with insitu alignment verification-deliver significant cost-of-ownership (CoO) benefits.
Features
- High resolution top and bottom side splitfield microscopes
- Handling of multiple wafer sizes with quick change-over time
- High degree of automation (multiple send/receive cassettes)
- Manual substrate loading capability on automated system
- Windows® based user interface
- Options
- Cassette-to-cassette handling system
- Automatic alignment
- Insitu alignment verification
- Field upgradeable from manual to fully-automated version
- NanoAlign® package for enhanced process capabilities
- Thin or warped wafer handling
- Nanoimprint lithography and micro contact printing
- Bond alignment
- Active vibration isolation
- Simulation software for mask aligner lithography process