EVG®540 Automated Wafer Bonding System

Configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp plasma bonding.

 

The EVG540 is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications. Based on modular design the EVG540 provides a proven solution for later transition of wafer bonding processes from R&D stage to large-scale manufacturing on our fully integrated production bonding systems.


Features

  • Fully-automated processing with automated loading and unloading bond chucks
  • Single chamber production bonder
  • Automatic handling of up to four bond chucks
  • Compliant to high safety standards
  • Modular bond chamber design
  • Active bottom side cooling