EVG®820 Lamination System

For punching and lamination of dry adhesive tape on carrier wafer.

 

The EVG820 Lamination Station is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer. This unique lamination technology performs punching of the adhesive tape supplied on a roll, followed by alignment and lamination. The Material usually is a double-side adhesive tape, either thermal- or UV- release. With punching technology size and dimension of tape are freely selectable and independent from substrate.

Features

  • Automated, stress-free and void-free lamination of any kind of dry adhesive film onto the carrier wafer 
  • Precision- aligned lamination on carrier wafer
  • Protective liner peel-off
  • The lamination station can be integrated into a EVG850 temporary bonding system