The EVG805 is a semi-automated system for debonding thin wafers from
sapphire, quartz or silicon carriers. Dependent from the intermediate
material, various debond approaches are possible. As for waxes and
thermo-plast materials a thermal-activated, mechanical slide-off is
utilized. For UV-activated tapes, UV-exposure and wedge-off debond is
utilized. The thin wafer can be unloaded on a single substrate carrier for
save and reliable transport between tools.
Features
- Semi-automated thermal release intermediate layer debonding
- Recipe controlled system
- Unique features for thinned wafer handling
- Various chuck designs to support wafer/substrates and carriers up to
200 mm
- Options:
- UV assisted debonding