For fully automated and integrated wafer loading, alignment, bonding and
unloading of bonded wafers.
Advanced Packaging and 3D-IC Market driving strong growth for EV Group's automated 300-mm polymer adhesive wafer bonding systems
EV GROUP organizes Photonics Workshop in Conjunction with MICRO AND NANO ENGINEERING (MNE) Conference
Leading CMOS image sensor manufacturers receive 300 mm fusion wafer bonding systems
EV Group Launches New Flagship Model in its GEMINI® FB Family
EV Group Corporate Video