A maximum level of automation and process integration is achieved by the
Gemini. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm
(300 mm) for volume manufacturing are all performed in one fully automated
platform. Device manufacturers benefit from increased production output, a
high integration level and a big choice of process variations like anodic,
silicon fusion, thermo-compression and eutectic bonding.
Features
- Fully automated and integrated platform for wafer-to-wafer alignment
and wafer bonding
- Configuration options for bottom side, IR or SmartView alignment
- Multiple bonding chambers
- Wafer handling system is separated from bond chuck handling system
- Modular design with swap-in modules
- Combines all benefits from EVG's precision aligners and EVG500 series
systems
- Minimized footprint compared to stand-alone systems
- Options:
- LowTemp plasma bonding
- Wafer cleaning
- Coat module
- UV bond module