With over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production.
Permanent Wafer Bonding: The introduction of EVG's wafer-bonding approach, which separates the bond alignment from the bonding step, immediately revolutionized the market. Utilizing high-contact forces under elevated temperatures and a controlled atmosphere, this novel approach is today's process standard, with EVG holding the dominant market share for both semi- and fully automated wafer bonders and a growing installed base of more than 500 chambers. EVG's wafer bonders offer manufacturers manifold benefits, including optimal total cost of ownership (TCO), as well as a real wafer-wedge compensation unit to maximize the bonding yield. Its bond alignment systems, such as the SmartView Aligner, can be integrated into a fully automated GEMINI production wafer bonder, which can support sub-micron alignment accuracies even with non-infrared (IR) transparent wafers. As it did with MEMS manufacturing, the company is now leveraging its technology strengths to accelerate the success of 3D wafer stacking. In support of this technology transfer, EVG developed chip-to-wafer bonding tools for high-yield heterogeneous 3D integration schemes and was the first to market with 300mm wafer bonders.
Temporary Wafer Bonding: Building on its success in permanent wafer bonding, EVG introduced automated, temporary bonding and debonding technology to address compound semiconductor and 3D IC manufacturers' immediate need for high-yield processing of ultra-thin and fragile wafers. The EVG technology temporarily mounts a wafer onto a carrier by applying thermal or UV-release intermediates (e.g., spin-on polymers, waxes, resists and dry-film laminates), providing manufacturers with several key benefits. These include optimal design-process flexibility, high yield (via the rigid carrier support), ease of integration into an existing fabrication infrastructure, and a highly reliable debonding step following complete front and backside processing.