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EV Group Europe & Asia/Pacific GmbH
DI Erich Thallner Strasse 1
A-4782 St. Florian am Inn
Austria


Phone: +43 7712 5311 0
Fax:     +43 7712 5311 4600
E-Mail:  Webinfo@EVGroup.com

Register Court Ried im Innkreis Austria
Handelsgericht A-4910 Ried i. I.
Handelsregister Nr. 316 392 h

About EV Group (EVG)

EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications.  Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines.  Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS.  Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon-via (TSV) process for chip packaging and MEMS/sensors.  Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, AZ.; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan.  The company's unique Triple i-approach (Invent - Innovate - Implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. More information is available at www.EVGroup.com.



Data, design and specifications may not simultaneously apply; or depend on individual equipment configuration, process conditions and materials and may vary accordingly. EVG reserves the right to change data, design and specifications without prior notice.

All trademarks, logos, website addresses or equipment names that contain the letters or words "EVG" or "EV Group" or any combination thereof, as well as the following names and acronyms are registered trademarks and/or the property of EV Group: ComBond®, CoverSpin™, EZB®, EZ Bond®, EZD®, EZ Debond®, EZR®, EZ Release®, GEMINI®, HERCULES®, HyperIntegration®, IQ Aligner®, LowTemp™, NanoAlign®, NanoFill™, NanoSpray™, NIL-COM®, OmniSpray®, SmartEdge®, SmartNIL™, SmartView®, The Triple "i" Company Invent-Innovate-Implement®, Triple i®. ZoneBOND® is a registered trademark of Brewer Science, Inc. Other product and company names may be registered trademarks of their respective owners.