News Archive 2013

Singapore-MIT Alliance for Research Technology Orders EV Group Automated Production Bonding System for Silicon-On-Insulator and Direct Wafer Bonding

  201312_EVG850LT   ST. FLORIAN, Austria, December 10, 2013 - EV Group (EVG) today announced that the Singapore-MIT Alliance for Research Technology (SMART) has ordered an EVG®850LT fully automated production bonding system designed for silicon-on-insulator (SOI) and direct wafer bonding using low-temp plasma activation processing.  SMART, which is a leading research center established by the Massachusetts Institute of Technology (MIT) in partnership with the National Research Foundation of Singapore, will utilize the EVG850LT system to support its advanced substrate development efforts.

더보기...
 

EV Group Introduces Full-Field UV Nanoimprint Lithography System for Photonics, LED and BioMEMS Production

  EVG720-Automated-Nanoimprint-Lithography-System-(with-cleanroom-floor)   ST. FLORIAN, Austria, December 3, 2013 - EV Group (EVG) today introduced the EVG®720 automated UV nanoimprint lithography (UV-NIL) system.  Providing full-field imprint lithography with an integrated soft stamp/template fabrication capability, the EVG720 system enables throughputs of more than 60 wafers per hour with the lowest cost of ownership (CoO).  Capable of printing nanostructures as small as 40 nm in diameter over a large area in volume production, the EVG720 system is ideally suited for use in manufacturing optics, photonics, light emitting diodes (LEDs), microfluidics and other bioMEMS devices, as well as advanced data storage devices. 

더보기...
 

EV Group Introduces Non-Contact Lithography System for Cost-Efficient Volume Production of Passive and Active Photonic Components

  EVGPhableWafer   ST. FLORIAN, Austria, November 19, 2013 - EV Group (EVG) today introduced the EVG®PHABLE™ exposure system, which is designed specifically for manufacturing photonic components.  Leveraging EVG's expertise in photolithography, the EVG PHABLE system incorporates a unique contactless lithography mask-based approach that enables full-field, high-resolution and cost-efficient micro- and nanopatterning of passive and active photonic components, such as patterned structures on light emitting diode (LED) wafers, in high-throughput production environments.

더보기...
 

EV Group Ships Lithography System to Micronit for Lab-On-a-Chip and Optical MEMS Device Production

201310MicrofluidicMicronit   MICROTAS, Freiburg, Germany, October 28, 2013 - EV Group (EVG) today announced that it has delivered an EVG®6200 semi-automated mask alignment system to Micronit, a manufacturer of lab-on-a-chip products used in life sciences applications, such as molecular diagnostics and point-of-care, as well as micro-processed glass substrates for MEMS applications.

더보기...
 

EV Group Introduces Roll-to-Roll Nanoimprint Lithography System For Biomedical, Optical And Flexible Electronics Applications

2013_10_EVG570R2R    PLASTIC ELECTRONICS, Dresden, October 8, 2013  - EV Group (EVG) today introduced the EVG®750R2R-the industry's first roll-to-roll thermal nanoimprint lithography (NIL) tool.  Jointly developed with the Industrial Consortium on Nanoimprint (ICON), helmed by A*STAR's Institute of Materials Research and Engineering (IMRE), the EVG750R2R utilizes hot embossing to mass-produce films and surfaces with micro- and nanometer-scale structures for a variety of medical, consumer and industrial applications, including micro-fluidics, plastic electronics and photovoltaics.  The first system has been installed in IMRE's Singapore facility, where it will be used by IMRE to conduct industrial research on the potential uses for large-scale nanoimprint patterning, as well as by EV Group for product demonstrations with prospective customers.

더보기...
 

EV Group Unveils New Via-Filling Process to Improve Reliability of 3D-IC / TSV Packaging

2012_09EVG150preview    SEMICON TAIWAN, Taipei, September 4, 2013 - EV Group (EVG) today unveiled a new polymer via-filling process for 3D-IC/through-silicon-via (TSV) semiconductor packaging applications.  Available on the EVG100 series of resist processing systems, the new NanoFill™ process provides void-free via filling of very deep trenches and high-aspect ratio structures, and is suitable for all common polymeric dielectrics-offering a highly flexible, low-cost and production-ready via-fill platform for interposer development for 3D-integrated image sensors and other device types.

더보기...
 

Dow Corning Joins EV Group's Open Platform for Temporary Bonding Materials for 3D-IC Manufacturing

201307EVG850TBDB    ST. FLORIAN, Austria, Sept. 3, 2013 - EV Group (EVG) announced today that Dow Corning has joined its network of top technology providers to support EVG's LowTemp™ platform for room-temperature wafer bonding and debonding processes.  The addition of Dow Corning - a global leader in silicones, silicon-based technology and innovation - to EVG's industry-leading list of collaboration partners follows intensive co-development efforts between the two companies.

더보기...
 

EV Group Achieves Triple Crown in 2013 VLSIresearch Customer Satisfaction Survey

  201308_VLSI   ST. FLORIAN, AUSTRIA, August 14, 2013 - EV Group (EVG) was ranked as one of the 10 BEST suppliers in the world in VLSIresearch's 2013 10 BEST Focused Chip Making Equipment Suppliers.  Customers also ranked EV Group as a THE BEST Silicon Wafer Fab Equipment Supplier in 2013.  EV Group is additionally distinguished with a 2013 RANKED 1st award in Other Silicon Wafer Fab Equipment.

더보기...
 

3D InCites and TechSearch International Announce the Winners of the First Annual 3D InCites Awards

   201307173DIncitesAward   Phoenix, AZ and Austin, TX - July 16, 2013 - 3D InCites, the premiere online content source for reliable 3D technology information, and TechSearch International, the leading market research and intelligence firm for advanced semiconductor packaging technology, today announced the winners of the first annual 3D InCites Awards Program, established to recognize achievements to further the commercialization of 2.5D and 3D IC technologies.

더보기...
 

Leti and EV Group Launch a Common Lab on Wafer Bonding Technologies

   2013_07cealeti   GRENOBLE, France – July 10, 2013 – CEA-Leti and EV Group (EVG) have launched a three-year common lab to optimize temporary- and permanent-bonding technologies related to 3D TSV integration and all direct bonding heterostructures. The lab, which continues more than 10 years of collaboration between the two organizations, is focusing on hardware, software and process development.

더보기...
 

EV Group Showcases Latest Photovoltaic Manufacturing Advances at Intersolar North America 2013

   2013_07intersolar   INTERSOLAR NORTH AMERICA, San Francisco, July 9, 2013 - EV Group (EVG), a leading equipment supplier for photovoltaic (PV) cell and module manufacturing, including anti-reflective and anti-soiling coating, nanoimprint lithography, thin-wafer processing, wafer bonding and photolithography equipment, today announced it is showcasing its latest innovations for improving performance and reducing costs of next-generation PV cells and modules at Intersolar North America this week at the Moscone Convention Center in San Francisco. 

더보기...
 

A*Star IME Consortium to Develop Advanced Packaging Solutions for Cu Pillars, 3D-EMWLP and Power Electronics with Leading Semiconductor Companies

  a-star_logo   Singapore, 9 July 2013 – Reliability and performance issues are technical challenges in packaging solutions for compact sized consumer electronics and high power electronics. To address these issues, the A*STAR Institute of Microelectronics (IME) and leading semiconductor companies have joined to form the 12th Electronics Packaging Research Consortium (EPRC12).

더보기...
 

EV Group Celebrates Strong Growth and New Manufacturing Process Solutions at SEMICON West 2013

  2013_07roundup   SEMICON WEST, San Francisco, July 9, 2013 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved strong revenue growth and expanded its headcount for the first half of 2013.  The company attributes this success to continuing demand for its flexible process solutions designed to address high-volume manufacturing (HVM) needs across multiple markets-including 3D-ICs, MEMS, power devices and compound semiconductors. 

더보기...
 

EV Group Pushes the Limits on 3D-IC Manufacturing for Next-Generation CMOS Image Sensors

  201307EVG40NT   ST. FLORIAN, Austria, July 8, 2013 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the latest version of its EVG®40NT automated measurement system, which is designed to work in concert with the company's GEMINI® FB fusion wafer bonding system to support the manufacture of next-generation 3D-integrated CMOS image sensors.

더보기...
 

EV Group Enhances Wafer Debonding Solutions Portfolio with New LowTemp™ Room-Temperature Debonding Platform

201307EVG850TBDB   ST. FLORIAN, Austria, July 1, 2013 - EV Group (EVG) today introduced its LowTemp™ debonding platform, which features three different room-temperature wafer-debonding processes and an extended material supply chain.  The platform includes two new debonding processes that have been qualified for EVG's high-volume production temporary bonding/debonding (TB/DB) systems-UV laser debonding and multilayer adhesive debonding-in addition to EVG's ZoneBOND® technology, which has already been implemented into production across the compound semiconductor and advanced packaging markets. 

더보기...
 

New Consortium for 2.5D Through-Silicon Interposer Technology to Benefit Computer and Consumer Electronics Industries

  ICON_rolltoroll   Singapore, 24 June 2013 – A*STAR Institute of Microelectronics (IME) has launched the 2.5D Through-Silicon Interposer (TSI) Consortium to accelerate market adoption of TSI technology, which is driven by strong demands in computer infrastructure and consumer electronics. Members of the consortium include key industry players across the manufacturing ecosystem: eSilicon Corporation, EV Group (EVG), KMG Ultra Pure Chemicals Pte. Ltd., Synopsys International Ltd., Tezzaron Semiconductor Corporation, United Microelectronics Corporation (Singapore Branch) and United Test and Assembly Center Ltd (UTAC).

더보기...
 

EV Group and Dynaloy Jointly Develop Complete Single-Wafer Cleaning Solution for 3D-IC/TSV, Advanced Packaging, MEMS and Compound Semiconductor Applications

2013_06EVG320RS-XT   ST. FLORIAN, Austria and INDIANAPOLIS, Ind., June 17, 2013-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, and Dynaloy, LLC, an international manufacturer of chemicals for the electronics industry and wholly owned subsidiary of Eastman Chemical Company, today introduced CoatsClean™-an innovative single-wafer photoresist and residue removal technology designed to address thick films and difficult-to-remove material layers for the 3D-ICs/through-silicon vias (TSVs), advanced packaging, microelectromechanical systems (MEMS) and compound semiconductor markets. 

더보기...
 

Fraunhofer ISE Teams up with EV Group to Enable Direct Semiconductor Wafer Bonds for Next-Generation Solar Cells

FraunhoferISE   Freiburg, Germany, June 4, 2013 - The Fraunhofer Institute for Solar Energy Systems ISE today announced that it has joined forces with EV Group (EVG) to develop equipment and process technology to enable electrically conductive and optically transparent direct wafer bonds at room temperature.

더보기...
 

VLSIresearch announces 2013 RANKED 1ˢᵗ awards

2013_RANKED1st_Logo    ST. FLORIAN, AUSTRIA, May 24, 2013 - EV Group (EVG) takes the lead for its bonders in the "Other Silicon Wafer Fab Equipment" category of the RANKED 1st awards, which identify the top suppliers in each of the 2013 VLSIresearch Customer Satisfaction Survey categories.

더보기...
 

VLSIresearch announces THE BEST 2013 Suppliers

2013_VLSI_THEBEST    ST. FLORIAN, AUSTRIA, May 23, 2013 - In its 11th consecutive appearance in THE BEST Suppliers this year, EV Group (EVG) was awarded seventh place in the Silicon Wafer Fab Equipment category. This new, consolidated category of the 2013 VLSIresearch Customer Satisfaction Survey replaces the previously separate Large and Small Wafer Processing Equipment categories.

더보기...
 

VLSIresearch announces winners of the 2013 10 BEST Suppliers of Chip Making Equipment awards

2013_10BEST_Logo    ST. FLORIAN, AUSTRIA, May 22, 2013 - Customers ranked EV Group (EVG) as one of the "10 BEST Suppliers of 2013" in the latest VLSIresearch Customer Satisfaction Survey. The market research firm received feedback from more than 98% of the chip market, asking worldwide participants to rate equipment suppliers among fifteen categories based on three key factors: supplier performance, customer service, and product performance.

더보기...
 

EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System for Micro- and Nano-Electronics Production

2013_05_EVG120   SEMICON SINGAPORE, May 7, 2013-EV Group (EVG) today introduced the latest version of its EVG®120 automated resist processing system.  Incorporating new features and improved productivity in an ultra-small footprint design, the EVG120 system supports coating and developing applications for a variety of markets, including microelectromechanical systems (MEMS), advanced packaging and compound semiconductors. 

더보기...
 

EV Group Ships 300mm Wafer Bonding System to Leading Chinese Semiconductor Foundry for 3D-IC and Advanced Packaging Volume Production Applications

2013_03_EVGGemini   ST. FLORIAN, Austria, March 13, 2013 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has installed a fully automated 300-mm system from EVG's Gemini® product family of integrated wafer bonding clusters to a leading Chinese semiconductor foundry.  This customer will use the system for 3D IC integration and advanced packaging-two high-volume applications for which EVG's wafer bonding solutions have become the de facto industry standard.

더보기...
 

EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology

  2013_03_EVGComBond    ST. FLORIAN, Austria, March 5, 2013 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is developing equipment and process technology to enable covalent bonds at room temperature.  This breakthrough technology will be available on a new equipment platform, called EVG580® ComBond®, which will include process modules that are designed to perform surface preparation processes on both semiconductor materials and metals. 

더보기...